Obtained a Bachelors degree from the University of Florida in Materials Science and Engineering.

• Designed bump layouts in AutoCAD for test chips with 1.59x1.59mm and 2x2mm die sizes, designed to reduce mechanical stresses transmitted into the die• Integrated electroplated copper strain gauges into design to monitor stress experienced by the die in experimental package designed for mechanical isolation• Performed height analysis for standoff polyimide structures by referencing failure analysis imaging of similar packages and evaluated the necessity of METTOP under polyimide seal ring • Coordinated meetings with DPDL to approve die designs for PG and facilitate PG process• Identified inconsistencies in rule-checking database for package layouts• Aligned with isolation team and ensured that any proposed changes to ruleset and ABOM identifiers coincide with the needs of the team• Initiated update request to better accommodate needs of isolation packages and match identifiers between isolation ABOMs and rulesets and facilitate design rule checks