Providing expertise in: * Product Generation Processes – product life cycles, product design processes, and product implementation * Marketing – market identification & development, product positioning, product specifications, and outbound marketing * Business Development – customer acquisition, partnerships, and merger & acquisitionsRecent clients include firms in the Semiconductor Test, Wafer Probing, and Financial Service industries. Project topics have included: supply chain issues, market studies, customer development, design process development, product introductions, and merger & acquisition analysis.

MEPTEC (MicroElectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers, manufacturers, and vendors concerned exclusively with packaging, assembly, and test. Since its inception over 30 years ago, MEPTEC has provided a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to packaging, assembly, and test. Through our monthly luncheons, symposiums, and an Advisory Board consisting of individuals from all segments of the semiconductor industry, MEPTEC continuously strives to improve and elevate the roles of assembly and test professionals in the industry.

TestConX over the course of its twenty-year history has established itself as the preeminent event for test consumables, test cell integration, and test operations. The program scope has expanded over these years from packaged semiconductor “final” test and burn-in to encompass all practical aspects of electronics testing including validation, advanced packaging testing, system level test, module test, and beyond to finished product test.Annual events include:+ TestConX - in early March in Mesa Arizona+ TestConX China - rotating locations in China in September/October (started in 2015)The events brings together over 450 (US) / 300 (China) professionals for a comprehensive technical program, exhibits of the latest products and services plus many opportunities to meet and network. These participants included end users and suppliers of sockets, wafer probe, load boards (PCB), burn-in systems, automated test equipment (ATE), handlers, packages and other related equipment, materials, and services.

BiTS is the world's premier workshop dedicated to providing a forum for the latest information about burn-in and test tooling, test strategy, and related fields. In addition to a comprehensive technical program, there are exhibits of the latest products and services plus many opportunities to meet, network, and explore ideas with other test and burn-in strategies professionalsThe workshop brings together almost 400 participants, representing more than 100 companies from around the world, and more than 45 exhibitors. These participants included end users and suppliers of sockets, load boards (PCB), burn-in systems, handlers, packages and other related equipment, materials and services.

Identified new markets, developed new business opportunities and managed customers and partners. Achieved 320% increase in sales year over year with overall growth rate of 250%. • Managed business and technical relationships, including technology transfers, which enabled customers to successfully qualify and transition prototypes to high volume manufacturing (HVM). Supported product demand ramp for HVM and new technology development.• Formed and managed an exclusive partnership with a major defense contractor to develop and manufacture the next generation of “Safing & Arming” technology.• Hired, trained and motivated European and Japanese representatives. • Directed outbound marketing including trade shows (6 in 2009 with 4 international).

Managed multiple semiconductor interconnect products based on photolithographic MEMS from conception through customer production orders. Developed NanoNexus technology into viable products as well as sold and marketed both products and company to customers and investors.• Hired, trained, and directed an Application Engineering team to successfully deliver and support products world-wide.• Supervised internal designers, subcontractors and vendors in the design and production of photolithography masks, printed circuit boards (PCBs) and CAD / EDA design tools.• Developed product outgoing assembly and test process. Selected, qualified and implemented capital equipment including metrology system.• Established phase review life cycle process for both product and process development. Produced product roadmaps, requirements, cost analysis, yield models, characterization and test plans.• Administered $10M NIST Advanced Technology Program consortium federal grant. Managed two California Technology Investment Partnership Program state grants.

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Developed and managed a startup business within Agilent Technologies (now Verigy Ltd.) to integrate semiconductor test equipment (STE) into customers’ engineering and high volume manufacturing environments for wafer probe and packaged part test. Rapidly grew this profit-center to support the sales of Agilent STE products and to enable Agilent to be a total solution provider. Transitioned my unit from full custom projects to standardized products and customized projects to improve customer satisfaction, reduce lead times and improve profitability.

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Responsible for managing and resolving all manufacturing issues between design divisions and globally distributed manufacturing sites for the successful introduction and volume ramp up of several generations of Hewlett-Packard mini-computers.