Team lead for Customer Return failure analysis cases which oversees: - Failure characterisation- Suggesting best possible EFA technique on a case by case basis.- Ensures the throughput time and success rate are within KPI. - Hosts and chairs critical team meetings to drive engagement and competency build up across the team. Compotent in failure analysis on wafer die level using advanced techniques:- Electro Optical Probing (EOP)- Electro Optical Frequency Mapping (EOFM)- Soft Defect Localization (SDL)- Optical Beam Induced Resistance Change (OBIRCH)- Photon Emission Microscopy (PEM)- Lock In Thermography (LIT)- Laser assisted Device Alteration (LADA) Competent in understanding VLSI schematics and complex circuitry to isolate the location of the defect. Familiar with wafer fabrication flow to understand the expected electrical signature during Electrical Fault Analysis and Nanoprobing to further aid in localizing the defect. Capable to perform physical failure analysis using concentrated chemicals for die extraction, usage of parallel die lapper, inspection of die using high optical microscopy and Scanning Electron Microscopy (SEM). Second job role is the main lead for lab automation using Power BI and Microsoft Power Automate. 1 QR code system for inventory tracking and multiple Power BI dashboard was developed from scratch that is currently used on a daily basis in the lab. The data that was displayed helps in understanding what are the shortcomings of the lab in terms of success rate and overall throughout time to further understand and improve on quarter on quarter.

Main task given was to ensure test equipment which were planned for relocation to be calibrated and ensure optimal performance before and after the relocation. This was carried out by leading and scheduling which tester is needed to be calibrated and perform SPC prior to relocation while making sure each tester is fully utilized in testing lots prior to relocation. Within 2 months, several machines were relocated safely and performance of each machine was maintained.