Resonac Corporation.Electronic Business Headquarters.R&D on advanced semiconductor packaging materials, including substrate, photoresist and temporary bonding/debonding materials.

Resonac Corporation.Institute for Advanced Integrated Technology.R&D on materials for Advanced Semiconductor Packaging such as Temporary Bonding Film (TBF), low Dk/Df Redistribution Layer (RDL), Damascene and various adhesive materials.

Showa Denko Materials Co. LtdAdvanced Technology Research & Development Center (Organic Materials Research Department)

Showa Denko K.K.- Institute for Advanced and Core Technology: Nanocarbon-elastomer composite- Institute for Integrated Product Development: Redox Flow Battery, Lithium Ion Battery, Solid-State Battery, Fullerene-based lubricant additive

Portfolio Management and Equity Analyst

Recruited to give General Chemistry lecture and Inorganic Chemistry Tutorial for Undergraduate Student in Department of Chemistry, University of Indonesia.

Hired to teach Chemistry Subject (General, Inorganic and Organic Chemistry) to nation-wide selected senior high school students who will participate as Indonesia delegates in annual International Chemistry Olympiad (IChO)