Isaac Simpson

Isaac Simpson Email and Phone Number

Principal Thermal and Mechanical Engineer @ EIZO Rugged Solutions
Orlando, FL, US
Isaac Simpson's Location
Orlando, Florida, United States, United States
About Isaac Simpson

Thermal/Mechanical Platform Architect. Specializing in CPU/GPU component definition and system level integration. Collaborates across Engineering Disciplines to drive consensus of product definition. Leads engineering activities and mentor's junior engineers to deliver evaluation of next generation processors. Drives innovation and establishes engineering processes to be used across the organization.

Isaac Simpson's Current Company Details
EIZO Rugged Solutions

Eizo Rugged Solutions

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Principal Thermal and Mechanical Engineer
Orlando, FL, US
Website:
eizorugged.com
Employees:
42
Isaac Simpson Work Experience Details
  • Eizo Rugged Solutions
    Principal Thermal And Mechanical Engineer
    Eizo Rugged Solutions
    Orlando, Fl, Us
  • Eizo Rugged Solutions
    Principal Thermal/Mechanical Engineer
    Eizo Rugged Solutions Oct 2023 - Present
    Orlando, Florida, Us
  • Intel
    Thermal/Mechanical Architect
    Intel Feb 2018 - Feb 2023
    Santa Clara, California, Us
    Responsible for thermal/mechanical requirements definition for next generation Processors. Generate customer collateral for integration into end product.
  • Intel
    Thermal/Mechanical Architect - Discrete Graphics
    Intel Jan 2018 - Feb 2023
    Santa Clara, California, Us
    Responsible for Thermal/Mechanical requirements definition for next generation discrete graphics chips. Generate customer collateral for integration into end product.
  • Intel
    Thermal/Mechanical Lead Engineer
    Intel Jan 2015 - Jan 2018
    Santa Clara, California, Us
    Generate test hardware and thermal module samples to validate performance targets are achievable. Established procedure, method, and tools for thermal/structural analysis of thermal solutions. Mentor junior engineers during the creation of test hardware and collaterals.
  • Intel
    Sr. Mechanical Engineer
    Intel Jan 2005 - Dec 2014
    Santa Clara, California, Us
    Generated intel owned IP for unique mechanisms and form factors to achieve new usage models and expand PC market. Interfaced with HW, electrical, industrial design, and power delivery engineering teams to create original designs and specifications. Managed ODM design teams to deliver HVM capable designs for notebook, convertible,handheld, and all in one design.

Isaac Simpson Education Details

  • University Of Washington
    University Of Washington
    Mechanical Engineering

Frequently Asked Questions about Isaac Simpson

What company does Isaac Simpson work for?

Isaac Simpson works for Eizo Rugged Solutions

What is Isaac Simpson's role at the current company?

Isaac Simpson's current role is Principal Thermal and Mechanical Engineer.

What schools did Isaac Simpson attend?

Isaac Simpson attended University Of Washington.

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