• Lead Program Manager for Revio system (instrument, SW, chip/consumable, chemistry, ~200 people). • Worked closely with onsite and remote Marketing, Engineering, and Manufacturing teams to develop system concept and lead the team from concept into development with multiple prototypes available.• Ran weekly core team meetings and lead phase reviews. Created overall schedule (concept to commercialization), department schedules, and resource plan. • Managed department plans, risk analysis, build plans, and design reviews.

• Program Manager for instrument and chip for Sequel system family (Sequel, II, IIe) from Development, V&V, and Design Transfer.

• Managed instrument design, transfer of manufacturing, and release of the Maxwell RSC DNA/RNA sample concentrator for worldwide distribution. This was a multi-site project involving a Korean and two US sites with distributed responsibilities for design, application engineering, and manufacturing. Completed on time and $900K under budget with all known reliability problems addressed.• Transferred manufacturing from US site to Korean site for Maxwell CSC IVD clinical instrument incorporating reliability, manufacturability, and software changes.• Worked cross functionally with marketing, design engineering, and applications engineering to create marketing, product, and engineering specifications for clinical and research instruments.

• Ran design control development program with engineering, regulatory, and marketing to achieve CE mark and approval to ship medical optical glucose meter in Europe.• Wrote and instituted procedures, programs, and templates to allow integration of new features into existing design control architecture and improve cross functional communication.• Created and maintained system BOM and product configurations.

Utilized multidisciplinary skill set in design engineering, process engineering, and manufacturing to rapid expand Solyndra's manufacturing capacity to 112MW.•Second employee of Fab 2 where I worked on factory integration, automation, MES specification, process integration, capacity modeling, layout, cost reduction, and factory startup.•When company resources were limited, I was able to seamlessly step into shift manager and production control rolls.•Outsourced medium volume production parts to China/Malaysia with a 50% cost savings (4.5 mil). •Able to reduce panel cost by 5% in 6 months through process changes, labor savings, and vendor negotiations

6th employee at Solyndra responsible for manufacturing operations and process development/transfer.•Successfully transferred NREL CIGS process to Solyndra's unique cylindrical substrate at NREL to provide proof of concept for first round funding.•Ran manufacturing operations at NREL, Pilot Line, and Fab1 startup.•Worked on hardware/process design and qualification for all key process steps (clean, Moly sputter, CIGS, CdS, TCO sputter, Testing, packaging).•Wrote hardware and process procedures.•Hired and trained 60+ new managers, engineers, and technicians.

Part of the design team for the CuSeal™ electroless Cu plating system.•Design owner of the chemical delivery system, system AC, and chemical bulk delivery unit.•Developed and communicated maintenance procedures and engineering developments to customers.•Supported tools, CEs(customer engineers), and customer training onsite and in the field.

• Part of new systems development group, responsible for new platforms for Applied Materials.CMP (Chemical Mechanical Polishing), Reflexion LK• Lead systems engineer for Reflexion LK Polisher responsible for mechanical design and electrical integration.• Wrote engineering specs to define all aspects of system operation and closed all Semi S2/8 safety issues.• Lead prototype and first customer tool build team; engineering, materials, safety, GPS, and technicians.• Worked with vendors during design to allow sub-modules to be outsourced with minimal engineering support.CMP (Chemical Mechanical Polishing), Desica Cleaner, Fixed Abrasive• Designed mainframe, skins, and datum controls which reduced alignment times by 50%.• Identified key process parameters from Obsidian fixed abrasive system and transferred them to Reflexion platform.• Developed innovative vacuum holding system to keep polishing web in place during high force wafer processing,• Field retrofitted Fixed-Abrasive platens onto standard Reflexion™ platforms at customer sites.PVD (Physical Vapor Deposition) 300mm Endura SL• Designed the fluid and gas delivery module on the 300mm Endura™ SL.ECP (Electrochemical Plating) 300mm ECP• Supported the build, marathon, and redesign of the 300mm Copper Electroplating (ECP) tool.