Jack Hay Email and Phone Number
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Jack Hay is a President at Sequence Software at FFD, Inc. (Sequence & LockStep Software). He possess expertise in product development, characterization, thin films, materials science, r&d and 12 more skills.
Ffd, Inc. (Sequence & Lockstep Software)
View- Website:
- sequencesoftware.com
- Employees:
- 24
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PresidentFfd, Inc. (Sequence & Lockstep Software) Sep 2003 - PresentKnoxville, TnSequence is enterprise software that allows companies doing complex manual assembly to easily author, review, approve, and deploy work instructions required to build their products. It takes companies away from “tribal knowledge” in manufacturing to a systems approach that leverages existing information from MRP/ERP systems, engineering software, and shop-floor management systems for useful, highly-pictorial work instructions. Primary market segments served are medical and military.
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Research StaffFast Forward Devices Nov 1999 - Sep 2003Knoxville, TnWorking with my business partner I identified and realized novel solutions to materials characterization needs, with special emphasis on nanoscale systems. Duties included inventing, developing, and manufacturing of testing instrumentation to characterize specific physical or material properties, requiring expertise in mechanical and electrical prototyping. I participated at different levels in developing three different instruments. Efforts resulted in 4 patents issued related to measurement of physical properties of small volumes.One patent was licensed out in 2015.Finally, I developed an internal software product for documenting technologies we wanted to license out. No commercial system was available that allowed us to easily document pictorial work instructions and manage part changes in the parts lists using Word and Excel. That system was later commercialized as Sequence Software.
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Research Staff MemberIbm, Tj Watson Research Jan 1998 - Nov 1999Yorktown Heights, NyAs a member of the low dielectric constant (low-k) research group, I participated in developing, identifying, and characterizing next-generation dielectrics for integration in back-end-of-the-line (BEOL) interconnect structures. Specific highlights included leading a task force for solving integration problems associated with the poor structural properties of low-k materials, characterizing elastic properties of thin dielectric films, and identifying and developing methods for quantifying adhesion. Other duties included publishing papers, presenting work at technical meetings, and filing patent briefs with I.B.M.’s intellectual property organization (coauthor of two patents issued).
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Post Doctoral CandidateOak Ridge National Laboratory Jul 1996 - Jan 1998Oak Ridge, TnIn this appointment I explored the role of nanoindenation for evaluating mechanical properties on the sub-micron scale, especially for thin films or selected phases in composite materials. Experimental work drew on techniques using the AFM, SEM and nanoindentation. Analytical contributions included the development of a finite element model that describes the indentation process identifying the limitations of linear-elastic assumptions. -
Graduate Student And Postdoctoral ResearchUniversity Of Houston Aug 1989 - Jul 1996Houston, TxResponsibilities covered experimental research and teaching. Experimental work required development of novel testing equipment and techniques for characterization of toughening mechanisms in composites and monolithic ceramics from 20° C through 1600° C. Wrote and presented several technical papers and assisted in writing research proposals. I was also a teaching assistant for undergraduate classes on materials and electronic controls.As a post-doctoral student I initiated new research opportunities in fatigue-related damage of wake-toughening mechanisms in ceramics. Duties included design and construction of new experimental testing equipment and participation in writing journal articles and research proposals. In 1996 I also taught the department’s undergraduate Materials Science Laboratory. -
Summer InternAt&T May 1986 - Aug 1987Basking Ridge, NjSpent two summers (1986 and 1987) at AT&T as a summer intern.The Business Research unit of AT&T functioned as an internal consultant group looking at processes in the business units and solving problems or improving operations. My internships were spent on the Telemarketing Analysis and Reports System (TARS), which was a system developed to administer, track, and bill for Equal Access and Reach Out America programs through AT&T Telemarketing Services. Primary duties were analyzing and documenting the data model for that system.
Jack Hay Skills
Jack Hay Education Details
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Materials Engineering
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Materials Engineering
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Mechanical Engineering
Frequently Asked Questions about Jack Hay
What company does Jack Hay work for?
Jack Hay works for Ffd, Inc. (Sequence & Lockstep Software)
What is Jack Hay's role at the current company?
Jack Hay's current role is President at Sequence Software.
What is Jack Hay's email address?
Jack Hay's email address is jc****@****are.com
What is Jack Hay's direct phone number?
Jack Hay's direct phone number is +186592*****
What schools did Jack Hay attend?
Jack Hay attended University Of Houston, University Of Houston, University Of Houston.
What skills is Jack Hay known for?
Jack Hay has skills like Product Development, Characterization, Thin Films, Materials Science, R&d, Materials, Nanotechnology, Process Engineering, Business Development, Strategy, Cross Functional Team Leadership, Manufacturing.
Who are Jack Hay's colleagues?
Jack Hay's colleagues are Roman Yuzkov, Fu Ff, Lgs Wapda Town, Bao Hien, Steven Gibson, Molvi Ji, Stacky Ra-Man.
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