Jack Yeh Email & Phone Number

Austin, Texas, Us

• Materials, Processes, Products/Devices testing, characterizations and failure analysis in MEMS, Semiconductors, Thin-films and packaging technologies for development and improvement.• Materials Analytical Failure Analysis and Labs management• Reflow process optimization for fine-pitched ball grid array• Enabled QC/QA for contact elements manufacturing process monitoring including stamping, plating and post process corrosion control.• Established characterization methodology for materials packaging to optimize contact surface.• Improved system cooling for high-power servo application.

Livermore, Ca, Us

• A key technical consultant role in Materials, Processes, Devices testing, characterization & FA, incl. thermal/mechanical/electrical performance evaluation for R&D, mfg. & customer returns.• Led Materials Engineering Group drove projects to meet company current/future needs; including prototype evaluation, first article & materials/process qualification, specification initiation; established metrology/test methodology, QC/QA inspection protocol, SPC monitor; collaborated FEA modeling, FA/FMEA, Thermal, Reliability (HALT) and Corrosion evaluations.• Hands-on experiences in analytical tools/techniques such as Optical Microscope/Stereoscope, Dual–beam (SEM-FIB)/EDS, TEM, XRD, IR imaging, X-ray imaging, C-SAM, FTIR, Nano-indenter, Tribometer, Dage, microprobe station, analytical X-sectioning for structure, metallography and TEM sample preparations, reliability/environmental chambers, ICP-OES, as well as competent knowledge in IC decapsulation, Cap FA, light emission microscopy, EBSD, AFM, Auger, ESCA/XPS, TOF-SIMS, Raman, HPLC-MS, GC-MS, DSC/TGA, etc.• Experienced Materials Characterization/Chemical Analytical Labs management in operation, staffing, budgeting, tools selection/purchase/maintenance, operators/users training; Created/ maintained service protocols for submission/prioritization/tracking/reporting/documentation.• Experienced process, processing tool/modules troubleshoot in Lithography, Si-etching/ oxidation, PVD/CVD, vacuum engineering, wire bond, plating, dry/wet etch, lapping, diffusion, SMT/brazing/soldering, repair/rework, metal-(metal, polymer, ceramics) adhesion; Ceramic substrate/trace, Die epoxy molding/under-fill sealing characterization; mechanical properties measurement, metallography & fractography examination, analytical cross-sectioning technique, contact/wear analysis, reliability assessment supports etc.

Fremont, Ca, Us

• Coordinated BIST probe cards designed/developed in-house and outsourced CM productions operations; Owned assembly, test (components & final product), customer returns and FA/repair for chips burn-in/test in automotive sensors and memory applications.• Worked with probe card analyzer vendor to develop a unique metrology tool enabling tests on subassembly & final products for QC/QA, and performance measurement/improvement.

San Jose, Ca, Us

• Explored and identified overseas HDI PCB fabrication CM to drive outsourcing projects for Asia-pacific HVM to meet company series B funding requirements.• Evaluated optical profilometer (FRT) & AOI system for Pilot-line production metrology & defect inspection. Ran DOE for process development & production yield improvement. Utilized FRT, XRF, C-SAM, AA, X-sectioning technique for materials/process characterizations, e.g. deposit profile/thickness, microstructure-metallography examinations, and Failure Analysis.

Livermore, Ca, Us

• Led Materials Engineering Group drove projects to meet company current/future needs; including prototype evaluation, first article & materials/process qualification, specification initiation; established metrology/test methodology, QC/QA inspection protocol, SPC monitor; collaborated FEA modeling, FA/FMEA, Thermal, Reliability (HALT) and Corrosion evaluations.• Hands-on experiences in analytical tools/techniques such as Optical Microscope, SEM/EDS, TEM, XRD, IR imaging, X-ray imaging, C-SAM, FTIR, Nano-indenter, Tribometer, Dage, microprobe station, analytical X-sectioning, reliability/environmental chambers, as well as competent knowledge in IC decapsulation, Cap FA, light emission microscopy, EBSD, FIB, AFM, Auger, ESCA/XPS, TOF-SIMS, Raman, HPLC-MS, etc.• Experienced Materials and Failure Analysis Labs management.• Experienced process, processing tool/modules troubleshoot in Lithography, Si-etching/ oxidation, PVD/CVD, vacuum engineering, wire bond, plating, dry/wet etch, lapping, diffusion, SMT/brazing/soldering, repair/rework, metal-(metal, polymer, ceramics) adhesion; Ceramic substrate/trace; mechanical properties measurement, metallography & fractography examination, analytical cross-sectioning technique, contact/wear analysis, reliability assessment supports etc.• Used JMP/Excel for DOE and statistical data analysis, process optimization, identify BKM and establish POR for materials/process development and manufacturing process improvement.• Developed, implemented & drove a production tracking system to solve/monitor product performance issues identified at worldwide service centers and customer sites.• Materials fabrication development and performance characterizations: Successfully obtained experimental data driven thermal-mechanical deformation models for materials and process windows selections; determined Process-Structure-Property relations & US patents granted.

Greenbelt, Md, Us

• Drove project of "Contamination Effects on Extreme-Ultraviolet Reflective Mirror in Ultrahigh Vacuum" for Optics Branch at NASA/Goddard Space Flight Center.• Repaired an outer space environment simulated vacuum chamber for in-situ absorption-desorption studies to predict/extend the lifetime of EUV optics in satellite communication.

• Research study in “Kinetics of carbide formation of thin W & Mo films on CVD diamond structure”• Hands-on experiences in Microscope, TEM, SEM and RBS.

Hoboken, Nj, Us

• Research study in “Kinetics of carbide formation of thin W & Mo films on CVD diamond structure”• Built and maintained hi-vacuum annealing system, e-beam evaporator, sputter, PECVD/ECR reactors for Thin-films deposition/etching. • Hands-on experiences in Microscopes, TEM, SEM, XRD and thin films deposition/characterization tools. • Maintained Materials Laboratory, taught characterization techniques of SEM/EDS, metallography and image analysis system.

Chutung Township, Hsinchu County, Tw

• Established on-site Materials Characterization Labs at local industries. Taught practices of metrology, corrosion, metallography, fractography, failure analysis and mechanical testing for product (including steels/stainless steels) process QC/QA and improvement.• Gatekeeper for National Australia Testing Association (NATA) Laboratory Certification at MRL, ITRI. Hands-on experiences in cross-sectioning technique, Microscopy, SEM/EDS, mechanical testing, XRD & darkroom facility. Maintained tools up time for Lab operations.