As a seasoned engineering leader with over 15 years of experience in optical communications and integrated circuit (IC) design, I specialize in high-speed optical networking and digital signal processing (DSP). I have a proven track record of driving innovation from specification to silicon validation, delivering cutting-edge DSP-based IC solutions for data center interconnects, metro, and long-haul networks.Currently serving as Director of Engineering, I am recognized for building and leading multidisciplinary teams that drive strategic initiatives, reduce external dependencies, and enhance internal R&D efficiency. My technical expertise is balanced by strong leadership, project management, and financial acumen, enabling me to cultivate collaboration, innovation, and growth across teams and global partnerships.Over the course of my career, I have led the development of several high-capacity DSP-ASIC systems, including a flexible 400-Gb/s Coherent DSP-ASIC in 6nm and a 128-GBd RF IC for 800Gb/s applications. My experience spans startups, R&D institutions, and large corporations, where I have consistently secured significant R&D contracts, formed strategic partnerships, and published pioneering research in optical transmission technologies.With a PhD in Electrical Engineering, an in-depth understanding of the telecommunications landscape, and a passion for technological innovation, I am committed to pushing the boundaries of semiconductor and communications technologies, continuously seeking new challenges that contribute to the industry’s advancement.