APAC General Manager 2024/7 - now: Leading Product Management, Quality, Logistics teams and Hong Kong/Taiwan/Shenzhen office in APAC to achieve the corporate P&L.VP, Product Development 2022/7 - 2024/6: Leading Product Development team, Quality team, Operations team, and Engineering team in APAC; Overseeing the entire product development process in developing, modifying, and launching new products; Managing the product development strategies from ideation to the final execution, market release, and lifecycle management.

After Lenovo merged with IBM PC Division in May 2005, joined Lenovo Group.• Hardware Manager 2005~2007: Led a major relocation program in transferring the ThinkPad Accessories Product Development team from the USA to Shenzhen, Guangdong, China (total of 37 HCs).• Senior Hardware Manager 2007~2009 / Director 2009 ~ 2013: Head of ThinkPad Accessories Product Development team. Developed ~150 products into the market every year. Contributed ~800M USD revenue and ~350M USD profit to Lenovo Group.• Director 2013~2019: Merged ThinkPad (Commercial) and Lenovo (Consumer) Accessories Product development team as one team (total ~100 HCs); Delivered around ~500 products (docking (USB 2.0, USB 3.0, TBT3, TBT4, USB C), HID, Dongles, USB Storage, Power Bank, Camera, Speaker, Headset, Stands, Carrying Case, etc.) to the market per year. Contributed ~1.2B USD revenue and ~450M USD profit to Lenovo Group. Established Lenovo IoT development team in 2016, delivered products like Smart Band, Smart Air Purifier, Smart Watch, Smart Strip, and Smart Home kit in China market.• Operation Director 2019~2022: Managed Lenovo Visual & Accessories product development team BMS, budget, expense, compliance, etc. Managed portfolio assessment with the Marketing team and PoC (Prove of Concept) portfolio. Director of Visual Accessories Product Assurance team to secure the product quality during the development phase. Contributing ~3.4B USD revenue and ~800M profit to Lenovo Group.

Managed IBM ThinkPad HDD/ODD second source qualification in IBM China Development Lab.

• Establish a development center in China, recruited engineers, and set up process with US team.• Achieved 24 hrs continuous design with US team to shorten the development cycle.• NPI role to make sure design introduced to mass production

• RMA Controller: Oct 1998 ~ Oct 2000: solved customer issues via technical support, controlling motherboard replacing from overseas hubs (mainly in the US and Europe), etc.• RMA Factory Manager: Oct 2000 ~ Oct 2002: promoted as manager of a small factory (around 50 people) in Futian Free Zone. Repaired all returned motherboards from overseas. Maintained the inventory of overseas motherboard hubs. Drove collaborative relationships with the development team and feedback design defect issues to improve future product designs. • Project and Validation team manager: Oct 2002 ~ Dec 2003: Promoted to R&D manager to cover project execution and motherboard qualification in the development phase.

- Introduced Japanese equipment and electrical components to China market.- Supported and resolved technical issues reported from customers.

- Maintained Boeing / Airbus aircraft in HAECO