I have worked on the development of OPC internalization tools and have established and led the AI OPC team. I have experience in Rigorous OPC, Compact OPC, deep learning modeling, and Ab-initio device simulation. Additionally, I have developed tools for AI-based lithography simulation, correction, AI model reliability estimation techniques, pattern sampling, pattern generation, along with various programming skills. I have a profound understanding of semiconductor devices and processes. During my doctoral studies, I delved into first principles calculations of semiconductor materials, thus gaining a fundamental understanding of semiconductor materials. At Samsung, I led the development of semiconductor process simulation internalization tools, accumulating diverse knowledge and experience in the field.I am looking to build upon my experience and track record in the development of AI-based OPC tools to pave the way for future AI-based DPTCO (Design Patterning Technology Co-Optimization) development. Leveraging my expertise in AI-based OPC tool development, I aim to embark on the design of AI-based design infrastructure, enabling AI-based design optimization for Process/Design Co-optimization.