Tizen is Samsung’s home-grown operating system that is based on Linux Kernel. The first Tizen Phone Samsung Z1 released in India in the month of Jan -2015.Role : Chip level troubleshooting, Hardware Testing, GPIO Configuration, R.F Calibration & testing Environment : Windows Tools : AGILENT 8960 series 10 E5515C wireless communication test set, AGILENT E3632A DC Power Supply, Fluke Millimeter), Tektronix digital phosphor oscilloscope DPO 4054B (500MHz) 2.5GS/s, Soldering station - Hakko 928/Metcal (MX-500P-21),Power monitor tool, Power Millimeter.~ Controlling and managing various subsystems of Test set Agilent 8960 and configuring lab Setup~ Test prime for GPIO configuration for all (RF, Audio, BT, LCD, Camera etc.) modules.~ Bought up the entire Test setup for test environment.~ Checking the Messages Like System info, Sleep current management for idle/connected mode~ Management & Preventive maintenance activity on all Hardware devices.~ Baseline the Test scenarios from the Device Schematics documents~ Identified and implemented the how to test part of the feature ~ Contributing, designing and debugging test cases as per plans and procedures~ Co-working with other development teams and testing teams throughout the build life cycle.~ Re testing the Issues & Updating tool.

~ All kind of CDMA & GSM mobiles RF fault analyzing, testing, repairing.~ Critical time RF circuit signal & component level troubleshooting.~ Have a great experience in L4 level servicing with SMD rework station.~ Expertise in Reworking of L4 (smd- BGA IC’s) Level Servicing.~ Well trained under working on various management methodologies namely 5s, six sigma.~ Mentoring freshers as per the working instruction (like handling instruments and rework skills) and also to support them with debugging.~ Responsible for Submission of Audit Reports, Process Issues, Corrective Action and Improvements to management through Quality Review Meeting.~ Responsible for periodic internal audits like Product Line Audit, ESD Audit, 5’S Audit etc.~ Responsible and implementing of new techniques, New Method, Corrective Action.~ Responsible for Yield, Process quality, Process issues.~ Knowledge about SMT Technology like trouble shooting of SMT Failures, Design of Stencil, Setting of Reflow, Wave Soldering Profiles, Solder paste Printing. ~ Reduction of Failures, Satisfaction of Customers like online Submission of Process Status like Yield report. Corrective Action & Preventive action for the Failures. ~ Continual Improvement of Process & Quality towards Improving Yield as per customer requirement. ~ Monitoring Product performance through Defect analysis Chart and Acting upon it.~ Monitoring the effectiveness of corrective action and Preventive actions