Principal Engineer/ Manager
CurrentLead focus Areas: Sensors, IoT platform, Modem, Machine Learning (Inference engines)Implementation lead for multiple projects and products at Qualcomm CR&D. Instrumental in working with product strategy, building the business case, fostering strong rapport with top-level Management, and creating a dynamic and efficient team to realize the product. Experience in working efficiently with cross-functional teams across (US, UK, and INDIA), and delivering milestones on time. Most of the projects have a cost of $5-$30 million associated with them and have created a unique IP and commercial value for the company • Neuro Signal Processing sub-system implementation lead for two generations of Machine learning inference processors in Qualcomm. Taped out the first server quality 7nm ML-SOC and worked on the tapeout of the next generation ML-SOC in 4nm. The compute efficiency at capacity for the NSP engine was >8 TOPS with design density >50M gates.• ASIC Implementation lead for the Ultralow Power AON core with ARM cortex © processor, stream NPU, and integrated audio in 28nm node, which will be used in the next-generation sensor and IoT products @ QCOM.• ASIC Implementation lead for Ultralow Power Image sensor chip that works in conjunction with an ARM cortex© processor. It supports low-resolution image capture and recognition with embedded sensors.• Implementation lead for the ASIC back-end efforts for the UWB low power test chip(28nm) in Corp R&D.• Lead the Physical design (floor planning, P&R, PV, and timing closure) and ASIC back-end (Constraint management, Synthesis, STA, and FV) efforts for the first of the kind AsyncLogic test chip (65nm) and was responsible for getting the design timing closed and taped out well ahead of schedule.• Implementation lead for multiple cores (IPs) that were integrated into the MSM 9XXX portfolio and shipped to customers.