Worked as a module engineer to support the multi-wire saw (MWS) mechanical wafering process. Responsibilities included:-Designed and optimized new process for the MWS area which approximately doubled throughput and saved nearly $1 MM annually compared to previous process-Process monitoring/optimization through use of statistical software packages and data collection-Used SQL database queries in combination with Excel, StatGraphics, and JMP-Troubleshot equipment issues alongside process and equipment engineers-Coordinated with operations and maintenance resources to ensure equipment function with high resource efficiency-Managed project work to decrease process run times and increase quality-Ownership of process documentation and training to ensure up-to-date practices were used

Worked in processing to support purification and CVD coating processes in the fabrication of iso-molded graphite parts. Was responsible for maintaining high throughput and yields, troubleshooting process issues, and coordinating equipment maintenance.

Worked on cross functional engineering team responsible for electroplating processes. Performed plating distribution analysis for copper. Oversaw process development and implementation for various plating practices. Practiced and used principles of Six Sigma/5S for process monitoring and control.

Chemical mechanical planarization (CMP) techniques, material science, and surface chemistry concepts were applied to optimize/model wafer polishing. Design of experiment employed with 3 factors and 9 responses. Prepared polishing slurries for use in CMP. Submission of report abstract to Material Research Society (MRS) for 2015 San Francisco meeting. Presented research during MRS poster sessions.