Goal driven, results oriented PCB Designer and Technologist with a 35 year proven record of comprehensive accomplishments in schematic capture, placement, constraint management, high speed routing with signal integrity over different interconnect technologies including traditional through hole, HDI, ELIC, multilayer flex/rigid flex, embedded component technology, micro electronics, and IC packaging. Work in an environment with multi disciplined teams to develop feasibility studies, program layouts, trade-offs, design validation for 3D-DFM, DFA, RF and digital critical controls, and ESI.System cost and mass production driven SME, with experience in laminates, interconnect technologies, mass PCBA fabrication and reliability testing. Developed roadmaps, drove interconnect technology materials, vendor fabrication specifications and requirements, design capability and cost impact, technical negotiations in emerging materials, process development, reliability / qualification, and recyclability.AREAS OF COMPETENCIES• 35 years industry / Motorola telecommunication experience and emerging technologies• 29 years of experience in micro electronics, IC packaging, interconnect technology (PCB, flex circuits, and ridged flex) , embedded technology, and mass manufacturing• 20+ years of product development, material procurement, and technical negotiations• 15+ years of environmental material and process development, qualification, and recyclability• 30+ years of experiences with CAD tools such as Cadence Allegro, Mentor, Advanced Package Designer (APD), Valor.