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Safety minded, hands on Process & Equipment Engineer with expertise in consistently achieving business, customer and profit objectives by improving manufacturing capabilities using Lean Manufacturing principles to drive results. Background includes both Process and Equipment Engineering roles using root cause analysis and troubleshooting to improve product yields and cost reductions within dynamic global organizations. Calm, stabilizing force that contributes accurate, intuitive decision making to team successes. Held a DOD-Secret level clearance in the past.Specialties: CVD, PVD, PECVD, Plasma & Wet Etch, Installation Projects, De-installtion Projects, Cost Reductions, Lean Manufacturing, Six Sigma, ISO Work Instructions, PM Improvements, SPC, Safety Improvements, Alumina, Silicon, Glass, Lithium Niobate Modulators, Process Development, Process Characterization, Continuous Improvement, Lithium Niobate Crystal Poling
Moxtek
View- Website:
- moxtek.com
- Employees:
- 182
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MoxtekSalt Lake City, Ut, Us
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Staff Process EngineerMoxtek Jan 2016 - PresentOrem, Ut, UsManufacturing site Optical and X-ray divisions, producing devices for commercial, industrial, militaty and space applications.Etch process engineer, oxide and metal etch (Lam Research 9600 and 4520 and Kiyo45), producing wiregrid polarizers & beam splitters on a variety of 200mm glass substrates.- Lead the project to find our next generation of etch equipment, including research & demo testing. Proposed and justified Lam 2300 platform with Kiyo45 chamber. Project was approved and purchased. Working with R&D to develop next gen products utilizing this advanced etch capability; while concurrently converting selected older products with difficult specs that yield poorly on legacy equipment.- Site admin for Inficon Fabguard FDC. Replaced Brookside (Lam Station) across fleet of etchers, adding additional equipment types along the way. Has led to faster diagnosis of problems, reducing scrap.- Helped conceptualize and implement Automation for Etch area, eliminating operator misprocess scrap for wrong recipe (~2500wfr/yr)- Mentor junior team members
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Staff Process EngineerLumentum Oct 2012 - Jan 2016San Jose, California, UsManufacturing site for Lithium Niobate Modulators for the Telecom, Defense, and Cable industries.- process owner for Trench Etch, improved yields by reducing incoming defectivity and working with design team to re-design trench mask to maintain CD width across the wafer. - process owner for Diffusion & Crystal Poling; Poling yields were improved from near zero to >98% by performing multiple DOEs to map the process interactions, improving the product design to enable a more robust process, and making multiple maintenance improvements on the equipment set. - qualified a new waveguide diffusion process across multiple devices that improves yields and lowers device losses- wafer/substrate owner,1st point of contact for wafer issues and qualifications. Initiated a project to qualify second source vendors to alleviate the risk of being single sourced on our primary raw material and in the process capture a significant cost savings.- Site Safety Committee member -
Sr Equipment Engineer, Metals/Cmp/Cvd/EpiFairchild Semiconductor Jan 2010 - Sep 2012Phoenix, Arizona, UsEquipment Engineer Metals, Thin Films & Epi 4/12 – 10/12In addition to duties as Metals Engineer, asked to fill a gap in Thin Films & Epi. With the primary goal of reducing downtime at chronic Fab constraint SACVD. AMAT Centura (SACVD, EPI [RP + Atm])Metals 1/10 – 3/12Var 3280/3290, Var XM8, CHA Mark 50, Oerlikon CLN200, Centura WxZ/WxP, & Endura PVD- Increased availability of AMAT Centura Tungsten CVD (WxZ/WxP) from 73% to 95%- Coordinated and led the deinstallation of a WxP chamber and installation of a WxZ chamber with minimal impact to production on one of a kind tool- Installed 3 Enduras, Centua WCVD, and Oerlikon CLN200-1 for new 8-inch facility- 3280 PM Improvement Team – reduced Post PM fails by >80%- 5S+ Zone Champion – mentor 4-shift team during 5S implementation and sustainmentEquipment installation, continuous improvement, and manufacturing support for front and back metal deposition, epitaxial growth, and thin films including:- New 8" Facility: AMAT 5200 Centura (WCVD, SACVD), AMAT 5500 Endura, Oerlikon CLN200-1, Ebara FREX200- 6" Sustaining: AMAT 5200 (WCVD, SACVD, EPI), Novellus C1, Varian 3280/3290, Varian XM80, CHA Mark 50, Oerlikon CLN200-2 -
Etch Equipment EngineerFairchild Semiconductor Jun 2008 - Jan 2010Phoenix, Arizona, UsWet & Dry Etch 1/09 – 12/09Wet systems, TEL Unity ME, LAM (4400, 4500, 4600, 9400, Alliance 9400, 9600), Gasonics (PEP 3510 + Irridia, L3510), Tegal (901, 960), Matrix (106)- Installed Alliance 9400 DFM system, & upgraded multiple systems from PTX to DFMWet Etch 6/08 – 12/08Variety of wet etch sinks, and Semitool SRD & SAT systems- Partnered with Automation and Maintenance to lead a team that reduced scrap at Wet Metal Etch from one wafer a day to less than 1 wafer per month. Rebuilt the automation system, rebuilt the robots, and redesigned the PM systems to maintain the new scrap rate.- Traced and eliminated chronic local evacuations of Etch area due to Ozone Alarms.
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Process & Equipment EngineerIntel Jan 2006 - Sep 2007Santa Clara, California, UsSuccessfully managed two Plasma Etch operations utilizing TEL Unity II DRM etchers and LRC 4420 etchers.• Increased LRC availability to 96% from 88%, with historic dog tool up to 96% from 71%; and 30% increase in scheduled vs. unscheduled maintenance during nine month span using Preventive Maintenance (PM) matching across shifts; troubleshooting (TS) historic RF issue and managing BOM to reduce waiting part downtime.• Increased TEL availability to 94% (up 7% on a two of a kind toolset) by PM Matching across shifts; partnering with Inter-Module defectivity team to increase efficiency, reducing unscheduled cleans by 60%; TS to root cause/resolving persistent intermittent particle failures.• Cost Champion/Team Leader that achieved annual savings of $1.2M by reducing Spares spending by $4/wafer start.• Drove efforts to reduce/eliminate worldwide TEL fleet‘s historical SECS Communication Errors by partnering with IT to characterize issue defining two separate reasons for error. -
Equipment Services ManagerOn Semiconductor May 2005 - Sep 2005Scottsdale, Arizona, UsMet FAB Decommissioning Project deliverables by effectively leading twenty technicians and two engineers that managed decontamination, decommissioning, breakdown, safety inspections, and global shipping processes.Achieved accelerated time requirements by shipping last tool two weeks ahead of schedule, with zero reportable injuries and no damaged equipment. -
Senior Equipment EngineerOn Semiconductor Oct 2003 - May 2005Scottsdale, Arizona, UsManaged Photo, Etch, and Metal areas and functioned as FAB Emergency Response Team member.• Gained 60 man-hours per week by reducing evacuations due to solvent smells as Cross-functional Team Leader that identified, isolated and remedied root-cause.• Achieved smooth installations of two DNS60A Systems, one SEMIX TRU6133 SOG System, and three Ultratech 1500 Steppers.• Developed PM Program that delivered 92% availability for DNS60A systems by authoring ISO Specs, launching Level I/II Training Courses and delivering OJT training/coaching of Maint/Proc/Manuf team members in proper tool operation/ maintenance.• Achieved 17% increase in equipment availability by developing/implementing new PM program.• Member FAB Decontamination & Decommissioning Team requested to stay, prepare for and execute FAB shutdown including preparation of tool specific checklists and protocols and construction of MS Access Database to track equipment during Shutdown operations.
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Senior Process EngineerOn Semiconductor Oct 2000 - Oct 2003Scottsdale, Arizona, UsMetal Deposition/Flip Chip/Backgrind Section Sustaining Engineer that managed day-to-day shift support throughout FAB including Statistical Process Control (SPC), ISO documentation maintenance, scrap reduction, and engineering projects.• Two year project involving the qualification of a change in Al-Cu metallurgy across ALL product lines by comparing FAB measurements (Photo & Etch CDs) & Post-FAB measurements (Parametric, Probe, Packaging, Final, and Life tests).• Root Cause Analysis Leader that eliminated a chronic high scrap rate issue, significantly increasing equipment availability while also developing a cleaning process with a new vendor and greatly reducing cost of ownership.• Installed and qualified new deposition tools• Converted Flip Chip metal deposition (Al-Cu & Under Bump Metal) to Varian 3290• Reduced 15:1 BOE acid use by 70% by implementing SPC charting.• Team Leader that reduced, by 40%, test wafer use with an annual savings of $621K.
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Process EngineerOn Semiconductor Jan 2000 - Oct 2000Scottsdale, Arizona, UsTechnical Shift Leader that provided weekend/holiday engineering coverage for entire FAB including supervising all process/ maintenance technicians. • Led Shift Scrap Response Team that achieved 66% reduction in FAB scrap rate & 85% reduction in scratched wafers by immediately evaluating, documenting and designing solutions to presenting issues. • Achieved >25% decrease in Spray Metal Etch scrap/rework by combining detailed metal deposition and etch tool process controls with improved maintenance procedures & training.
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Thin Films Process EngineerElectro-Films, Inc. Jun 1998 - Jan 2000Managed diffusion, PECVD, and PVD processes and maintenance functions; installed and characterized sputter tool (TaN, NiCr, and Al) and PECVD tool.
James (Jamie) Cooke Education Details
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United States Naval AcademyMechanical Engineering -
University Of Rhode IslandOcean Engineering
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Worcester Polytechnic InstituteMechanical Engineering
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Wyoming Seminary College Prep, Kingston, Pa
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Ledyard High School, Ledyard, Ct
Frequently Asked Questions about James (Jamie) Cooke
What company does James (Jamie) Cooke work for?
James (Jamie) Cooke works for Moxtek
What is James (Jamie) Cooke's role at the current company?
James (Jamie) Cooke's current role is Staff Process Engineer at MOXTEK.
What is James (Jamie) Cooke's email address?
James (Jamie) Cooke's email address is ja****@****msn.com
What is James (Jamie) Cooke's direct phone number?
James (Jamie) Cooke's direct phone number is +180180*****
What schools did James (Jamie) Cooke attend?
James (Jamie) Cooke attended United States Naval Academy, University Of Rhode Island, Worcester Polytechnic Institute, Wyoming Seminary College Prep, Kingston, Pa, Ledyard High School, Ledyard, Ct.
Who are James (Jamie) Cooke's colleagues?
James (Jamie) Cooke's colleagues are Lance Olsen, Jordan Sefcovic, Peter Guzmsn, Jason Thomas, Clark Blockburger, William Strieber, Emma Mcknight.
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