Jason Bi

Jason Bi Email and Phone Number

Sr. Principal Engineer at Teledyne LeCroy @ Teledyne LeCroy
Jason Bi's Location
San Ramon, California, United States, United States
Jason Bi's Contact Details

Jason Bi personal email

About Jason Bi

Principal Design Engineer with over 20 years professional experience in high-speed digital and analog circuit design, FPGA logic design, Signal integrity, System Integration, background in Semiconductor, Test Instrument, Wireless and Telecom, Ethernet and Storage industry.

Jason Bi's Current Company Details
Teledyne LeCroy

Teledyne Lecroy

View
Sr. Principal Engineer at Teledyne LeCroy
Jason Bi Work Experience Details
  • Teledyne Lecroy
    Sr. Principal Engineer
    Teledyne Lecroy Jan 2022 - Present
    Chestnut Ridge, Ny, Us
  • Teledyne Lecroy
    Principal Design Engineer
    Teledyne Lecroy Aug 2017 - Dec 2021
    Chestnut Ridge, Ny, Us
    Responsible for the following project design from hardware architecture design to deliver the product:- 32G PCIe/NVME/CXL Protocol Exerciser and Analyzer- 400G Ethernet/64G FC Protocol Analyzer.
  • Teledyne Lecroy
    Hardware Engineering Manager
    Teledyne Lecroy Feb 2016 - Jul 2017
    Chestnut Ridge, Ny, Us
    Managed the Hardware Department to develop 16G PCIe/NVME, 200G Ethernet/32G FC, SAS/SATA, USB, DDR Protocol Analyzer, established hardware team Schematic, PCB, Board and system test roles.
  • Teledyne Lecroy
    Sr. Staff Hardware Engineer
    Teledyne Lecroy Sep 2011 - Jan 2016
    Chestnut Ridge, Ny, Us
    As a senior Staff engineer, successfully designed the following products:• PCIe G4/3 Protocol Exerciser and Analyzer and Related products• 8G/16G FC and 10G/40G Ethernet Protocol Analyzer.• SAS/SATA 12G Protocol Analyzer• DDR3/4 Protocol Analyzer and Related products
  • Unigen
    Hardware Design Manager
    Unigen Nov 2010 - Jul 2011
    Newark, Ca, Us
    As a Sr. Design Manager, led the hardware team to handle all road-map production and customer ODM production design, the following important roles were played:• Created Architectural Design Specification for each production design.• Defined the hardware design rules to make sure all design phases can be done efficiently and correctly.• Designed the complicated Enterprise SATA III SSD which supported ONFI 2.0 and Toggle Mode NAND flash accessing.• Managed all Unigen road-map and customer ODM production design, and released it to mass production successfully. It coved SATA/SAS SSD, ODM SSD, DDR2/DDR3 module, WiFi and Bluetooth module, USB flash, SD/CF flash cards design.• Led the team to analyze RMA failure and gave the solution to fix.
  • Lecroy
    Senior Staff Design Consultant
    Lecroy Sep 2009 - Nov 2010
    As a principal design consultant, I had worked for PCI Express G3/2 products in the following roles:As a design engineer, designed PCI Express Gen3/2 Exerciser. PCIe G3/2 Exerciser is next generation PCIe trainer, which can generate all kind of PCIe patterns and monitor PCIe traffic from customer designed product at up to 8GBPS speed. This system is design on standard PCIe half size card, and has the CPU system and complicated FPGA on it. I started design this system from concept and finished it as a successful product by end of March 2010. In this project, the following roles were played:Concept Design.Schematic Design.Signal integrity and PCB layout supervise.System/Board bring-up and test procedure Design.Product support.As a team leader, worked on PCI Express Gen 3/2 Analyzer.PCIe G3/2 Analyzer is next generation PCIe production in LeCroy, which can monitor/recording/analysis PCIe traffic from customer designed product at up to 8GBPS speed. This is a complicate system that includes Controller, Recorder and Analyzer sub-system. In this project, the following roles were played:Test Automation System Architecture Design.System Test Procedure Design. Leading the team members to Bring-up/Troubleshoot the system.Working with the FAB house and production group to analyze the fail system.
  • Sirf, A Csr Plc
    Senior Staff Hardware Design Engineer
    Sirf, A Csr Plc May 2007 - Aug 2009
    As a leading engineer, I had worked for the different projects and have made the great contribution to the following tasks:SD IF Playback System Design. This is ARM microcontroller based system which is implemented in Xilinx Virtex FPGA, it continuously captures or playback high speed GPS IF data stream to/from high speed SDHC card through DMA mode, it is designed for validating GPS chip performance.In this project, the following roles were played:System Architecture Design.FPGA Logic Design and Implementation, which includes ARM and SDIO IP integration, RTL coding and simulation, FPGA Synthesis and place & Route, Timing Analysis.Technical lead for this design group.Pre-Silicon and Post-Silicon Validation Hardware Design for GPS Receiver Chip.I had worked the following fields: New Post-Silicon platform architecture design.Pre-Silicon Validation Platform required functional boards design; it includes Communication Interface Board, Memory Board, RF Interface Board and others.Post-Silicon Validation Platform required interface boards design.FPGA logic design for post-silicon GPS receiver chips validation.Signal Integrity on SOC Evaluation and reference board.I had completed the signal integrity on mDDR/DDR2 interface design for SOC chip on Evaluation and Tier 1 customer design boards, led the SOC hardware team to fix the design problem quickly and got the solid performances on Tier 1 customer's GPS products.
  • Kla Tencor Corp
    Senior Staff Hardware Design Engineer
    Kla Tencor Corp Jul 2001 - May 2007
    As a leading engineer, I had worked for the followoing different projects as the Architecture designer, Hardware designer, FPGA logic designer, and Signal Integrity engineer:- Charger CDG Systerm.- X Timing Controller board (XTC).- Charger Interface Board- CDG Stage Interface Board- High Speed Driver Board.- Acquisition Controller Board.- High/low Current Source Board- AZP board.On thw above projects, x86 CPU, PowerPC, DSP, DDR, Fiber Channel, Gigabit Ethernet, PCI/cPCI/VME, I2C/SPI technology involved to the design.
  • Us Wireless
    Senior Digital Hardware Engineer
    Us Wireless Jun 2000 - Jul 2001
    As a key engineer, designed Digital Receive and Processing Board for Radio Camera System, which was used in the E911 cellphone caller locating application for AMPS, DAMPS, CDMA and GSM standard.
  • Utstarcom Inc
    Senior Hardware Design Engineer
    Utstarcom Inc Oct 1997 - Jun 2000
    As a Key engineer, designed hardware and FPGA logic on Digital IF Receiver and Baseband Processing Boards, which are used for Soft Radio Base Station - WCDMA project.

Jason Bi Skills

Interface Design Networking Hardware Design

Jason Bi Education Details

  • Taiyuan University Of Technology
    Taiyuan University Of Technology
    Computer Engineering
  • Taiyuan University Of Technology
    Taiyuan University Of Technology
    Computer Engineering

Frequently Asked Questions about Jason Bi

What company does Jason Bi work for?

Jason Bi works for Teledyne Lecroy

What is Jason Bi's role at the current company?

Jason Bi's current role is Sr. Principal Engineer at Teledyne LeCroy.

What is Jason Bi's email address?

Jason Bi's email address is ja****@****ail.com

What schools did Jason Bi attend?

Jason Bi attended Taiyuan University Of Technology, Taiyuan University Of Technology.

What skills is Jason Bi known for?

Jason Bi has skills like Interface Design, Networking, Hardware, Design.

Free Chrome Extension

Find emails, phones & company data instantly

Find verified emails from LinkedIn profiles
Get direct phone numbers & mobile contacts
Access company data & employee information
Works directly on LinkedIn - no copy/paste needed
Get Chrome Extension - Free

Aero Online

Your AI prospecting assistant

Download 750 million emails and 100 million phone numbers

Access emails and phone numbers of over 750 million business users. Instantly download verified profiles using 20+ filters, including location, job title, company, function, and industry.