Jasper Wu Email & Phone Number

Taiwan

Taipei City, Taiwan

1. New platform survey and estimation2. System integration and schematics design 3. Layout (placement, layout guideline and DFM) 4. Co-ordinate with Audio/RF/ME/Optics/BSP/POE/Thermal team

New Taipei City, Taiwan

Experience/knowledge on smart speaker and smart display product. (MTK and Allwinner platform)Responsible for1. Lead 3 section departments, including EE/ power/Audio and RF(12 persons)2. RFQ assessment and make a proposal to customer3. Project schedule control (weekly project meeting)4. Con-call meeting with customer5. Schematics design and debug6. Layout (Placement, layout guideline and reviw)7. Arrange tasks and create verification plans for members8. Components selection and survey (cost and performance review)(Business trip: China for pilot run, USA-Seattle for amazon, USA-San Francisco for amazon)

Taipei City, Taiwan

Experience/knowledge on Qualcomm platform. (MSM8996/8953)Responsible for1. HW Project Leader 2. Customer design specification and issue communication3. Qualcomm module design (SOC+DDR+EMMC+PMIC+WIFI/BT)4. Qualcomm IO board design (USB HUB+ HDMI+ Charger+ Ethernet and so on)5. Schematics and PCB layout design

New Taipei City, Taiwan

Experience/knowledge on mobile phone and tablet HW design.Responsible for audit and co-working the ODM/OEM vendor (Tablet)1.Advanced technical study with chip vendor (Intel/MTK)2.Schematics and PCB layout design3.Create and deliver verification SOPs and plan to ODM/OEM vendor4.Co-work with ODM/OEM for debugging issues5.Project schedule control (weekly project meeting)6.Review ODM/OEM test reports 7.Audit production line (SMT line, assembly line and test line)8.Components selection and survey(Business trip: China for pilot run)Achievement:1. 1st 8-inch gaming tablet mass production(Intel platform)

Hsinchu County/City, Taiwan

Experience/knowledge on mobile chipset, including mobile phone and tablet.Responsible for1.Bring up & debug for a new chip (FPGA, EVB)2.System schematics and layout for a reference phone (RTC, multi-SIMs, GPIOs arrangement, LCM, Camera, I2C, UART, SDIO, SPI, USB, Micro SD card, Power circuit arrangement, sensors, Audio, Acoustics, NAND/ADMUX/LPDDR1/LPDDR2/Serial Flash/SPI NAND/ eMMC and so on.)3.Reference phone validation & debug from prototype to production. 4.New IP or new feature bring up with designers (32K-less, SIM interface-reduce reset pin)5.Create design notice (Application Note) for customers 6.Customer issues troubleshooting7.Review customer schematics & layout8.Benchmark analysis report (placement, feature, BOM cost and so on) Achievement:1. 2G/3G feature phone and smartphone chip set without 32K crystal mass production

New Taipei City, Taiwan

Experience/knowledge on 3.5G dongle and mini PCIE card architecture/devices including power circuit, memories (NOR Flash, SDRAM), I2C, USB2.0, UART, Audio Codec, Micro SD, CDMA2000 1X EVDOParticipated in new platform development/schematic design, including VIA, INFINEONResponsible for 1.Team management2.Schematic design and debug3.PCB layout review (placement, guildeline) 4.Antenna performance verification (OTA)5.RF performance verification (3GPP2)6.EMC certification/debug 7.Arrange tasks and make verification plan for team8.Components selection(Business trip: China for pilot run)Achievement:1. 1st 3G dongle and mini PCIE card mass production in Gemtek

New Taipei City, Taiwan

Experience/knowledge on smart phone architecture/devicesParticipated in new platform development/schematic design, including Qualcomm QSC6270 and TI OMAP3430Responsible for1.HW project leader (BB+RF)2.HW schedule plan with PM3.Con-call meeting with customer4.Schematics design and debug5.Layout (Placement, guideline and review)6.Components selection (Business trip: China for pilot run)Achievement:1. 1st Symbian smartphone presented to Nokia in FOXCONN

Taipei City, Taiwan

Responsible for audit and co-working the ODM vendor 1.Review ODM schematics and PCB layout design 2.Create and deliver verification SOPs and plan to ODM vendor 3.Co-work with ODM for debugging issues 4.Project schedule control (weekly project meeting with ODM HW leader) 5.Review ODM test reports 6.Audit production line (SMT line, assembly line and test line) 7.Components selection (Business trip: China for pilot run, Sweden for pre-FTA)Achievement:1. Initialize the HW test report document to deliver ODM's vendor2. 2 feature phone mass production at the same time (ODM:Arimacomm and FOXCONN)

New Taipei City, Taiwan

Experience/knowledge on feature phone architecture/devicesParticipated in new platform development/schematic design, including TI Calypso, TI Locosto and Philips Dragonfly1.HW project leader (From second year in ARIMA)2.Con-call meeting with customer3. Overseeing PCB layout design4.System schematics design and debugs5.Acoustic and audio circuit design and tuning 6.Charging circuit design 7.SMT and FATP FA8.Survey new components foe new feature/ cost down(Business trip: China for pilot run, Japan for NEC)Achievement:1.1st ODM feature phone mass production for Sonyericsson (total forecast: >8 million)2.Return fail rate <5%, get Quality Contribution Award from Sonyericsson.3.1st ODM clam shell phone mass production for china brand in Arimacomm.4.Successfully initialize and setup acoustics test environment for 3GPP requirement.

Master’S Degree, Department Of Electronic And Computer Engineering

Bachelor’S Degree, Department Of Electronic And Computer Engineering