Jay Watts Email & Phone Number

Redmond, Washington, Us

PMO servant leader, chief of staff and team builder of a highly empowered team of 2 professional TPM Directors and 10 TPM ICs. - TPM leader for a broad portfolio of cameras, sensors and sensor roadmaps for AR/VR devices including Hololens, IVAS (DoD program) and IoT devices. - Created PMO for 70+ person Sensors team, established critical infrastructure, championed appropriate process development discipline (PDP). - Established and led professional business management for entire Sensors organization including budget forecasting and tracking, resource planning, business priority setting, product and technology roadmap development. - Established business wide knowledge management plan, led creation of each department’s knowledge management site in Wiki and ensured ease of search for critical information for each user.- Created New Technology Innovation process to establish technology roadmap rigor and garner long term executive support. - Established and lead regular technology reviews with Sr. Executives. - Known for forming highly successful cross-functional teams (ME, ID, EE, FW, SW, ML/AI, Ops, Product Management) to deliver cutting edge hardware and software experiences. - Championed use of MSProject, SharePoint, standardized PowerPoint templates and issue tracking using Confluence.- Led Tiger team to successfully complete Hololens 2 development and mass production ramp. - Led sensor suite definition for PRD & ERD, led trade space development and down-selection for 4 new products from ideation to early-stage development.

Cupertino, California, Us

Responsible for leading and managing a global team of 2 PD EPM Managers and 10 PD EPM ICs to deliver next generation iPad products across the portfolio. Simultaneously led the development of the 2019 iPad Air as a System EPM from ideation to roadmap inclusion, product definition approval and development build execution.- Successfully collaborated with iPad PD, EE, RF, Test, Reliability, Operations, SW/FW and Module teams to design, build, test and execute across a broad portfolio. - Effectively managed $37M PD budget for development parts and fixtures. - Identified $10M development device savings and supported successful negotiations with top global CM.

Redmond, Washington, Us

Lead ME PM for Surface Pro 4 and Surface Pro 5 from ideation to mass production. - Collaborated daily with 25 MEs, EEs, ID, RF, HW Validation, Reliability, Operations and Sourcing to execute the product design, development, testing and validation. - Tightly managed ME design release schedules, material dock dates, supplier’s key activities (pFMEA, FAI/Cpk), budgets/POs, DOEs, risk analysis (dFMEA), build configurations and allocations. Successfully managed 15 Asia based suppliers across 300+ ME parts and subsystems to deliver all parts 98% on time to development builds with no build delays. - Successfully managed BoM development and change control for over 300 components.

Redmond, Washington, Us

Consumer electronics hardware engineering technical program manager focused on preparing for and executing hardware development builds during the early phase new product development process for 2 phones. - Led critical high risk sub-system development including supplier management, product engineering, product development, manufacturing and sub-system delivery to contract manufacturer for final assembly and test. Critical subsystems managed included highly complex rigid FPCAs and eMMC for handheld mobile devices. - Led IQC readiness at NPI facility.- Defined development build program manager role and took on additional responsibility.

Redmond, Washington, Us

Collaborated daily with Microsoft’s consumer & commercial electronics hardware engineering teams as the main point of contact to a large manufacturing, reliability, supply chain and IT organization to effectively manage the overall global product development and launch for new hardware products with high yields and world class quality utilizing CM factories based in China. - Champion and contributor to Microsoft’s new product development process.- Successfully led the development, manufacturing ramp and launch of several sub-systems for Kinect for Xbox360 (V1 and V2) and led entire NPI effort for Kinect for Xbox One. Simultaneously developed 2 new suppliers in China and, through skillful process engineering, ramped them to 650k units per week with over 99% yields and enabling the fastest selling consumer product ever to that point in time.- Successfully raised performance of Tier 2 supplier to Tier 1 level to fully develop and successfully launch Surface Table (1200+ BOM component device with 5 major sub-systems sourced around the world).

Redmond, Washington, Us

Led and managed team of 7 global software package engineers. Responsible for creating, defining, testing and executing all software structural package engineering for all Microsoft’s businesses worldwide. - Successfully turned around underperforming team. Championed process excellence, established clear expectations & metrics, consistently held people accountable for results, and led the rebuilding of key stakeholder relationships. - Contributed to bottom line packaging savings of over $35MM over a 4-year period (over 10% of worldwide COGS). - Increased productivity 54% with fixed headcount while completing 4 major worldwide non-standard packaging programs by redesigning team’s division of work to outsource more tactical functions.Responsible for creating, defining, testing and executing all software structural package engineering for all Microsoft’s businesses worldwide. - Proactively created effective global organization through driving a worldwide vision, mission, business plan, objectives, tools, ongoing partnering on all product launches and continuous communication. - Recognized as a strong team player and leader.

Corning, New York, Us

Responsible for creating and implementing division level manufacturing strategies for DWDM optical amplifier (EDFA) and dispersion compensation businesses.Led effort to fundamentally redesign the Division’s R&D, manufacturing, product design and customer approach. Performed a deep-dive root-cause analysis of the enterprise. Developed holistic solutions to address fundamental issues and improve business profitability. Formed and led cross-functional teams to develop new marketing approach, new product design philosophy, new product introduction process, and manufacturing processes (lean, agile mfg. mass customization, configure-to-order).

Corning, New York, Us

Hired and integrated 23 employees. Led 2 managers and 20 ICs across 2 multifaceted groups. - Created mission, strategy and vision. - Established and controlled multimillion dollar budgets. - Led several multi-million-dollar impact projects while simultaneously completed Master’s degree while receiving full pay and 100% tuition reimbursement.- Managed Packaging & Reliability Engineering and Process & Equipment Engineering departments simultaneously.- Achieved $42M cost savings versus $3.9M budget in hyper-growth of business from $125M to over $900M in sales over a 3-year period. - Implemented lean manufacturing across 15 production lines. Project completed on time and on budget ($964k). Trained over 2000 hourly workers and plant staff. Resulted in $3M reduction in factory floor inventory, 60% reduction in average cycle time, $20M inventory carrying cost avoidance, and 50% reduction in floor space while supporting production volume ramp of 68%. - Integrated internally sourced components into highest volume product. Exceeded customer expectation for delivery. Resulted in $11M incremental sales and $23M cost reduction.

Ms, Engineering & Manufacturing Mgmt

Bs, Aerospace Engineering