I have over 9 years of experience working in Manufacturing. Currently, I work as Samsung SDIEM Senior Quality Engineer, improving products and Quality at Supplier by using Quality analytics, such as 7QC tools, 8D problem solving process. Moreover, Global standardisation by Tool to Tool-Matching within EV Battery plants.Previously, I was Die Attach Process Engineer at ST Microelectronic, where I conduct investigation and resolution of product complaints related to defect and quality. Before that used to be as NPI Associate Engineer in Western Digital, focusing mainly on New product development on Production base; Pre-test development for New Product.Start Product Configuration Setup.Experiences: New Product Introduction(NPI), Engineering(Process), Quality(Supplier Quality).Competency: IATF16949 Internal Auditor (Management on 2nd Party Audit), Error Proofing Training (Poka-Yoke in manufacturing), 8D Problem Solving method training, The 7habits of Highly Effective People(signature program by Franklin Covey)
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Qa EngineerOnsemi Feb 2022 - PresentSeremban, Negri Sembilan, Malaysia -
Senior Supplier Quality EngineerSamsung Sdiem Dec 2017 - Mar 2022Seremban, Negri Sembilan, Malaysia-Assist in the engineering evaluation and qualifications of supplier for Battery Current Interupt Devices and CAN production.- Conduct Yearly Supplier QPA & QSA.- Interpret and implement the quality assurance standards. Analyze data to identify areasfor improvement in the quality system.- Review and understand product requirement for decision-making when quality issue arise.- Perform supplier situation analysis, define and execute quality improvement plan.- Perform analysis of existing processes and identifies improvement for process capability and process efficiency.
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Die Attach Process EngineerStmicroelectronics Jan 2016 - Dec 2017Muar, Johore, Malaysia- Assist in the investigation and resolution of product complaints related to defect and qualityissues as captured by CAPA according to the 7QC tool, Poka Yoke system and Kaizen.- Interpret and implement the quality assurance standards. Analyze data to identify areasfor improvement in the quality system.- Documentation: SOP, WI, FMEA, OCAP and Control plan for Die Attach process.- Review the daily non-conformance issues and dispose it accordingly. (Functional orCosmetic failures)- Ensure effective hand shaking process of new device introduction to the line and new processtechnology capabilities development.- Responsible for new material first article inspection and final buyoff.- Ensure robustness of process control to meet yield and thru-put expectation.- Fully participate to resolve the issue thru teamwork, and be the main coordinator for any internal audit programs. -
Npi Associate EngineerWestern Digital Aug 2013 - Dec 2015Petaling Jaya, Selangor, Malaysia-New product development on Production base; Pre-test development for New Product.- Start Product Configuration Setup (PCS)- Run ‘Qual Build’ to qualify or release of new components of hard disc.- Manage and report to the PE team ifthere is failure observed.- Support product for line and knowledge transfer to manufacturing or production team.- Perform rework/ conversion of the A-item materials to enable it to be consumed in HVMand thus reduce / eliminate the scrap cost.- Responsible to pull out and work with QE on executing the blocks to support HVMdemand on the best possible alternatives.
Jayaganesan Indran Education Details
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University Of Sunderland2Nd Lower Level
Frequently Asked Questions about Jayaganesan Indran
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Jayaganesan Indran works for Onsemi
What is Jayaganesan Indran's role at the current company?
Jayaganesan Indran's current role is Attended University of Sunderland.
What schools did Jayaganesan Indran attend?
Jayaganesan Indran attended University Of Sunderland.
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