Jayakrishnan Kundully Email & Phone Number

Experienced in Board Level design which involves Component Selection, Interface Design, BOM creation, Schematic Entry, Gerber Review, EMI/EMC testing, Board Bring up and Testing & Test Report Analysis & Firmware Development •QA/QC for the product releases.•Good knowledge of DSP,FPGAs, PPC ,TI DSPs and memory devices(DDR,DDR2,EEPROM,FLASH etc).•Good knowledge in different transducers Temperature sensors, Thermo-Electric Cooler, pressure sensors, IR sensors, Accelerometers, LASER sensors etc•Experience in Defence standards and Environment test standards (MIL-STD-810)for Vibration, shock, thermal cycling, acceleration, Altitude, Humidity etc• Embedded C• Industry 4.0.

Listed skills include Project Management, Evm Evk Design, Internet Of Things, High Speed Interfaces, and 46 others.