Passionate about driving excellence in the B2B packaging industry, I am co-founder of HiLe Packaging solutions in Singapore. We are a dedicated team of engineers and professionals crafting innovative packaging solutions that enhance supply chain efficiency and reduce environmental impact. With over 20 years of experience in addressing the unique challenges and opportunities in the packaging sector, I work with companies across the globe designing, sourcing and delivering packaging products that are innovative, high in quality and eco-conscious.
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DirectorHile Packaging Solution Pvt LtdSingapore -
DirectorHile Packaging Solution Pvt Ltd Aug 2007 - PresentSingapore• Co-founded HiLe in 2007 and successfully grew the business from scratch to a multi-million packaging design & product specialist organization from 25+ customers serving their diverse and unique packaging design and product development requirements. • Fostering a company culture that encourages innovation, collaboration, and growth; setup teams adept in packaging design & development and ensuring compliance with industry regulations and quality standards.• Work with leadership team for business strategy alignment, budgeting, financial forecasting, contracts and explore new business opportunities.• Well conversant with advanced packaging products design and development methods owing to my experience and formal education in mechanical engineering. • A champion in Product innovation, staying abreast of industry trends and emerging technologies to drive product development that meets the evolving needs of B2B customers; Responsible for developing and implementing sustainability strategies, such as eco-friendly materials and processes.• Distinction of handling key clients like HP, Siemens, SIPLACE, Apple, Philips, Solectron, Shinei, Motorola, Flextronics, Venture, TEC, Applied-Bio-Systems, Microsoft to name a few across the SEA and Indian Sub-continent regions. • Effective communicator with honed analytical, problem solving & organizational abilities. -
Packaging EngineerFlextronics Jun 2006 - Sep 2007Singapore• Successfully handled packaging of products like Printers- Laser jet and ink jet, Plotters (42” and 60” plotting machine), other electronic products like Portable photo printers, ADF (Automated Document feeders), Scanners, Advanced FAX machines, etc.• Led multiple projects conducting the Out of the box test (OOBE Test) for packed products to support customer assurance.• Pivotal in handling packaging, design and successful testing and LP1 and LP2 build of 60” Plotters • BOM structure management• PCO/ECN process change order and Engineering change notification management. -
Design EngineerJebsen & Jessen Sep 2000 - May 2006Singapore• Efficiently conducted packaging qualification to ensure the specifications are met in the design.• Design and testing of G5 Apple project in China• Developing a data bank for various packaging material and details, used by all the designers for quick reference.• Headed the short term on the site project in Penang Malaysia for Flextronics.• Successfully created over 96 designs in 2005 with the success rate of 95%.• Hold the distinction of designs being nominated for packaging design awards conducted by Singapore Packaging association for years 2003 and 2005. • Worked on ISO-9001 documentation and support.• Functioned as Design lead in the wooden crate packaging design for machines that are over 1000kgs • Lead in integrated packaging by using more than one packaging material for cost saving for customers and manufacturing feasibility. -
Design And Development EngineerHarmony International May 1997 - Jul 2000India
Jayakumar (Jay) K S Education Details
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Marketing -
Mechanical
Frequently Asked Questions about Jayakumar (Jay) K S
What company does Jayakumar (Jay) K S work for?
Jayakumar (Jay) K S works for Hile Packaging Solution Pvt Ltd
What is Jayakumar (Jay) K S's role at the current company?
Jayakumar (Jay) K S's current role is Director.
What schools did Jayakumar (Jay) K S attend?
Jayakumar (Jay) K S attended Nus, Pondicherry University, University Of Madras.
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