Jeannette Jacques, Phd Email & Phone Number

Dallas, Tx, Us

Dallas, Tx, Us

North Texas

Dallas/Fort Worth Area

Dallas/Fort Worth Area

• Provided Materials Science support across multiple Raytheon MAKE factories for RCCA, process development, and process optimization efforts. Thin Film technical liaison with ELCAN for various programs and Joint Capital Roadmap.• Served on the Thin Film team, supporting optical interference coatings for use on a range of substrate materials. Coordinate and communicate the Thin Film area road map and capital plan, providing routine area updates. • EO Innovations Chief Engineer for the fabrication of Stinger® optics, leading a dynamic team of cross-functional engineers and coordinating supplier interactions to complete continuous improvement and streamlining projects, as well as achieve and sustain high yield production ramp capabilities across fabrication and assembly areas.• Project facilitator and technical advisor for design, fabrication, and implementation of a novel deposition system for the fabrication of DAR (Durable Anti-Reflective) coated large area windows. Coordinated vendor and supplier collaborations for the selection of peripheral process equipment and facilities for a dedicated large window value stream, including both wet and dry window cleaning process development.• Principal Materials Engineer for multiple Internal Research & Development (IRAD) and process improvement efforts, including MeRLOT® alloy characterization and coating development, Enhanced Silver Based AR coatings, and Aluminum Fold Mirror Dimensional Stabilization. Project team lead to optimize the Afocal Value Stream through a module-based process flow, streamlined data management, and focused SPC (statistical process control).• Coordinated and managed coating source materials, including traceability, documentation, and vendor selection.• Presented Materials Characterization TIG Talk “HTI Head Mirror Coating Delamination RCCA” on 10/22/19.

Dallas/Fort Worth Area

• Direct a dynamic team of 12 engineers and technicians responsible for bolometer fabrication, wafer level packaging, saw, flex attach, test, and solar stability across a range of integrated commercial and military products.• Employ sound project management skills that effectively balance technical requirements, schedule performance, and resource availability. Drive a multi-disciplinary team and customer stakeholders to achieve milestones through both direct and influence management by focusing on key strategic goals and supporting a strong cross-functional team environment through conflict resolution, open communication, and workload balancing.• Serve as a member of Leadership Team for strategic planning, on Review Committee for new bids and proposals, and on Critical Review Board (CRB) for new process implementations.• Actively define and manage engineering forecast, including budget, consumables, failure analysis, and lot starts.• Coordinate monthly project reviews, including resource, schedule, and budget reporting to senior management.• Collaborate with design, integration, manufacturing, and customer representatives to determine and implement process changes to support improved manufacturability, yield, device performance, and reliability.• Responsible for development and enhancement of novel manufacturing processes to ensure a smooth transition of 17um and 12um products and processes from the development phase into production.• Employ a data driven and hands-on approach to advanced level process troubleshooting, metrics reporting, continuous improvement, documentation, Statistical Process Control (SPC), and tool monitoring.• Project lead for migrating bolometer factory to a modern web based Manufacturing Execution System (MES) with Advanced Configuration and Equipment Management functionality; including vendor selection, statement of work (SOW), project scope definition, and project schedule management across multiple factory areas and work teams.

Dallas/Fort Worth Area

• Analyze product performance at all stages of development, manufacturing, and customer integration to establish projects to improve the yield of an advanced micro-bolometer infrared detector manufacturing business; including incoming inspection, fabrication, packaging, acceptance testing, and customer calibration/returns.• Serve as the first line of defense for recognizing, identifying, and raising awareness to new and critical process issues and yield excursions, communicating the risk assessment to logistics and supply chain, as well as working with process owners to identify opportunities for continuous improvement and to systematically implement solutions.• Collaborate with Business Development to assess manufacturing capabilities, translate customer requirements into product specifications, and propose new specifications to balance cost, schedule, and production line integration. • Apply sound statistical analysis and effective root cause analysis to address yield issues by utilizing data collection, analysis, and visualization tools, as well as failure analysis techniques, to define, monitor, and report yield improvement project metrics to peers and senior management.• Build sustainable yield improvement methodologies and systems by leading the team responsible for in-house data visualization and statistical software development and deploying automated yield reporting, wafer map generation, and parameter overlay maps across all probe and test points.• Completed a deep dive cluster analysis to determine the dominant failure mode across all products that lead to the implementation of a modified pixel design and resulted in a reduction of cluster failures, improving yield by up to 15%. • SharePoint Administrator and proficient in MiniTab statistical analysis and the full suite of Microsoft Office products.

Dallas/Fort Worth Area

• Secret Level Security Clearance (Current Investigation): Clearance Investigation Date of 03/18/2008; Clearance Eligibility Date of 03/28/2008 • Oversaw a range of plasma etch and ash processes and equipment used in the fabrication of uncooled-Infrared (IR) VOx (Vanadium Oxide) bolometers and cooled-IR MCT (Mercury-Cadmium-Telluride) based focal plane arrays (FPAs) for commercial and military applications.• Executed the removal of metals, inorganic metallic compounds, oxides, and organic films for wafer and die level processing to satisfy the requirements of a range of product lines with a diverse materials base.• Coordinated cost and cycle time reduction, lean manufacturing, and process and product development activities.• Designed and executed experiments for process development, optimization, and new integration strategies. • Completed physical and failure analysis in support of root cause determination for a range of performance, yield, and defect related issues. Lead cross-functional teams in resolution of yield excursions.• Directed successful deployment of Dynamic Scheduler in Statistical Process Control (SPC) system InfinityQS (ProFicient) for automated management of time based tool qualifications across factories. Maintained database tables, completed user training, and defined approach for notifications, status dashboard, and software deployment.• Attained Administrator status for Statistical Process Control (SPC) system and SharePoint sites.• Demonstrated Power User of Document Control and Manufacturing Execution Systems (MES) with a solid understanding of quality systems and methodologies.

Dallas/Fort Worth Area

• Contributed to fabrication and delivery of MCT used in the generation of diversified cooled-IR FPA devices. • Performed inspections, defect analysis, process optimization, and integration activities across MCT and CZT (Cadmium-Zinc-Telluride) based products to satisfy facility delivery, yield, cycle time, and cost metrics.• Oversaw thin film deposition and metrology processes and equipment: Parylene, Cadmium Telluride (CdTe), and Zinc Sulfide (ZnS) Depositions; Fourier Transform IR Spectroscopy (FTIR) systems (Automated and Manual), Automated Inspection Tool, and Hall Effect Measurement System.• Directed successful migration of Materials Manufacturing Factory from paper travelers to an electronic MES.• Served as Administrator for SPC charts for process equipment, material inspections, and product performance.• Represented Critical Change Board (CCB) reviewing both manufacturing and development documentation across multiple factories for Quality Assurance. Lead the transition team aligning supporting process documentation and integrating automated data load and material grading features for Materials MES routes.• Interfaced with vendors in support of tool purchases, installations, maintenance, and upgrades.

Dallas/Fort Worth Area

• Directed MCT material work in progress (WIP) management and daily priorities to achieve cost, cycle time, and product delivery goals for the factory. Reported metrics on manpower, budgetary, resource, and inventory planning, effectively communicating risk management and corrective actions for delivery delays. • Supported Program Management and Business Development throughout the product life cycle, including bid and proposal generation, product development, transition to production, and sustaining efforts.• Supervised 20 process technicians, including FPA specialists, machine operators, and process specialists.• Coordinated safety initiatives, facility and manufacturing tours, and 5S Lean Manufacturing Activities.• Retained Research and Development Product Engineer role in addition to operational duties.

Dallas/Fort Worth Area

Developed novel mono-color and 2-Color MCT based FPA devices for Cooled IR applications. • Oversaw long-wave IR (LWIR) and mid-wave IR (MWIR) small pitch mono products and 2-Color MWIR-MWIR product lines across a range of read out integrated circuit (ROIC) and pitch platforms.• Supported the successful transfer of the 2-Color MWIR-MWIR product line into wafer level production.• Author and presenter at the 2009 Military Sensing Symposia (MSS) on 20um pitch sMW/MW FPAs.• Performed process development, process integration, and manufacturability activities. Assisted cross-functional teams with layout, design, testing, and FPA mount in support of a streamlined product development approach. • Identified areas requiring process optimization; developed and implemented process and metrology updates to support device yield, performance, and reliability in conjunction with a universal device fabrication methodology. • Completed electrical and functional data analysis in support of root cause determination for a range of performance, yield, and defect related issues. Provided across factory assistance in addressing yield excursions.• Performed Secondary Electron Microscopy (SEM) analysis and coordinated Focus Ion Beam (FIB) analysis. • Supervised technicians working on development material and focal plane arrays.

Dallas/Fort Worth Area

• Engineer within the Silicon Technology Development (SiTD) group. • Developed advanced 45 nm BEOL (Back End of Line) plasma etch processes (Via, Trench, Aluminum Cap, and Protective Overcoat). • Experience releasing tools for manufacturing and establishing tool qualification methodologies.• Lead the TopLeads Loop Team responsible for 45 nm BEOL metallization processes.• Generated, reviewed, and maintained manufacturing specifications and SPC charts.• Investigated Single-Layer (SLR) and Tri-Layer Resist (TLR) integrations for Immersion lithography to improve cost, manufacturability, resist poisoning, yield, and reliability.• Evaluated plasma etch properties and related damage for ultra low-k and low-k dielectric materials, including the manufacturability of novel lithographic materials.• Co-Inventor on Three US Patents: Patent #7910477, Patent # 7811942, Patent # 7569486• Co-Inventor on Three Innovation Disclosures (1) Improve Dual Damascene (DD) Trench Etch Micro-Loading (ML) and Uniformity resulting from non-design rule compliant alignment features on standard reticles. (2) Novel methodology for a lithographic rework process for a tri-layer resist (TLR) approach using plasma etch tools. (3) Novel in-situ ash approach for removing removing tri-layer resist (TLR) residue without impacting trench or via critical dimensions.• FEOL expert in ion implantation and activation annealing supporting graduate students with novel experiments addressing the fundamental behavior of dopants in amorphous SiGe alloy materials, including amorphous germanium and amorphous silicon. Semiconductor Research Corporation Liaison for Task ID 1372.001 entitled Amorphous Layer Diffusion and Regrowth.

Dallas/Fort Worth Area

• Assisted in development of mechanical reliability specification for low-k dielectric materials, based on underlying topography or dielectric stack effects and mechanical fracture strength. • Characterized mechanical stability of organosilicate glass (OSG) materials as a function of electron beam (e-beam) and ultra-violet (UV) cure treatments, including exposure to a range of environmental conditions and solutions. • Supported selection of processing equipment.• Co-Inventor on Two Innovation Disclosures: (1) Method to Improve Dual Damascene (DD) Trench Etch Uniformity through Selective Dielectric Curing and (2) Method to Increase Mechanical Fracture Robustness of Porous low-k Dielectric Materials through Plasma Treatment Densification• Co-Inventor on Two US Patents: Patent # 7342315 and Patent # 7341941

Sunnyvale, Ca

• Supported gate and transistor teams within SOI (Silicon on Insulator) product development. • Drove a Defect Monitoring project for a new reticle set, analyzing and reporting on project developments. • Designed experiments, conducted electrical and physical analysis, characterized process limitations, and defined Critical Dimension (CD) and Electrical measurement programs. • Collaborated with Foundry counterparts as part of AMD’s alliance with United Microelectronics Corp. (UMC). • 2002 Intern of the Year Award Recipient for the Sunnyvale, CA Site

Dallas/Fort Worth Area

• Member of the Copper Interconnect (CI) Loop Team. Coordinated Failure Analysis. • Developed capping system for in-line wafers scrapped for failure analysis, maintained web pages, and used SWAN Software to review integrated circuit layouts.

Dallas/Fort Worth Area

• Coordinated failure analysis for zero-yielding (scrap) wireless device wafers. • Researched, analyzed, and assigned scrap wafers to appropriate engineering modules. • Maintained Wireless Zero-Yield Database, calculating and reporting appropriate statistics.

Dallas/Fort Worth Area

• Involved with in-line defect analysis and problem solving, focusing on the identification of defect signatures, compositions, and sources. • Worked in defect sub-teams to develop measures to minimize future excursions.

Ph.D., Materials Science & Engineering

Activities and Societies: Materials Research Society (MRS) • Specialization in Electronic Materials • Graduate GPA 4.00/4.00 •.

M.S., Materials Science & Engineering

Activities and Societies: Materials Research Society (MRS) • Specialization in Electronic Materials • Graduate GPA 4.00/4.00 • National.

B.S., Materials Science & Engineering

Activities and Societies: Materials Research Society, Society of Women Engineers, Society of Plastics Engineers • Specialization.