Driven research engineer with expertise in experimental research, and process development, with proficiency in electronic packaging and interconnect technology research and development for electronics systems. Specialties:Prototyping, process design, product qualification, failure analysis, and reliability testing. Experience in electrical, thermal, mechanical reliability of electronic systems in areas such as SiC power MOSFETs, solar energy, diagnostic imaging, additive electronics, and flexible, conformal, three-dimensional electronic systems.Current interests include the integration of electronics, and hybrid packaging solutions, towards integrating and functionalizing additively manufactured designs.New product introduction, risk assessment and management.Reliability testing and analysis for harsh environment, and automotive & areospace electronicsDevice & system characterization & failure analysisSix Sigma Green BeltLevel 2 TRIZ trained