Leading a global organization of commercial and technical procurement and supply operations professionals charted with acquiring and delivering innovative, industry leading enterprise server solutions that power AWS’s world-wide IaaS cloud hyper scale data centers. Responsible for sourcing strategy, procurement and capacity fulfillment of compute, storage, networking and edge device verticals building the earth’s largest and most advanced IT infrastructure fleet. Over my 5 years tenure, I supported growing AWS’s equipment foot print 250% while shortening lead times and reducing host cost by employing LEAN Six-Sigma principles eliminating waste in extended factory complex across Asia, North America and Europe regions. Scope includes: Managing multi-$billon Capex spend of server and communications technology components, integrated design and contract manufacturing services, and intellectual property licenses spanning category segments of custom rack systems, printed circuit boards, power-supplies, thermal-mechanicals, robotics, and market commodities (substrates, integrated circuit digital logic and analog chipsets, interconnects, passives, and sensors/imaging). Architecting transformational, scalable business models that foster durable, differentiated competitive advantage by enhancing resilience, accelerating velocity, and maximizing efficiency and productivity performance metrics yielding superior output, quality, improving client experience satisfaction and returning best-in-class profit margin results for the enterprise.Incubating nascent technology start-up initiatives including DC security appliances, AWS branded internet-of-things (IoT) devices and quantum computing that promote big data workload, machine learning and artificial intelligence use case cloud services.Creating and implementing agile organizational design, capabilities and mechanisms aligning Purchasing, Engineering, Legal, Planning, Logistics, Finance & Analytics functional disciplines.

Core Competencies and Skill Mastery:• Engaging supplier account C-suite by articulating compelling business case that promotes influential business relationships, engender trust, and enable synergistic ecosystem partnerships. • Negotiating commercial agreement terms, IP rights and pricing.• Optimizing value-chain to capture entitlement, mitigate risk and minimize friction.• Specification, Multi-sourcing, Geographic Diversification, Competitive Tender, Selection/Award, On-Boarding, Inspection Audit, Qualification, Regulatory Certification, Performance Score-Carding, Should-Cost benchmark analysis, & Market outlook research• Enforcing confidential information security, trade compliance, environmental and ethical social accountability governance.• Executing NPI life cycle developments to intercept time-to-market launch milestone targets and ramp deployment of x86 Intel Xeon, AMD EYPC microprocessor and ARM SOC platforms.• Aggregated multi-echelon inventory policy that attenuates volatility to achieve customer service fidelity at low aging cost.• Exerting controllership to ensure investment affordability and asset utilization.• Role modeling corporate culture and writing white-paper studies, reports and proposal narratives.• Recruiting, vetting and coaching talent to reach full potential and impact.

Formed and led new organization chartered with manufacturing and deployment of pre-production, next generation Intel Core form-factor software developer systems and innovative proof of concept reference design systems targeted at Windows 2-in-1 Ultrabook PC and Chrome segments. Responsible for proto-type manufacturing solution strategy of surface mount printed circuit board and custom system mechanical assembly/test across outsourced Asian EMS/ODM and Intel factory networks. • Managed cross-functional group of 35 program management, supply/demand planning, materials purchasing, assembly process and out-going quality test engineers, building ~10K systems over 5-10 projects worth $25M/year• Oversaw program execution of manufacturing deliverables including; influencing DFM into specs to optimize yields, resolving quality excursions, volume forecasting, capacity modeling, vendor quotation/selection/ purchase negotiation, tooling, documentation, structural & functional test integration, build output, and logistics. Drove cost savings realizing $1M.• Championed investment in co-located insource manufacturing capability for advanced technology proto-type systems to accelerate delivery timing 12% over typical 4 Quarter product life cycle, increasing development efficiency, and leveraging customer representative reference layouts to improve Intel’s CPU package certification.• Aligned future product roadmaps with factory technology capability needs. Prioritized cap-x proposals and secured funding. • Established sample supply/demand planning team to streamline customer order fulfillment processes. Implemented build planning methodology and supply commit reporting to increase customer satisfaction with on-time delivery metrics. • Standardized system production cost model to improve R&D expense budget planning accuracy.

Led a group driving the sourcing, manufacture and delivery of pre-production Atom based reference design circuit boards to validation and software developers targeted at Android and Windows smart phone and tablet markets. Led a supply chain team enabling custom Intel specified power management ICs made by 3rd party semiconductor suppliers.• Grew a team of ~20+ program and materials managers, assembly process and test engineers across 4 global locations. • Managed contract EMS factories in Asia and the US shipping ~40K surface mount board assemblies over 100s SKUs to 100s of Intel engineering customers totaling $16M annually. Supervised daily operations including supplier statements of work, consigned material procurement, customer demand management, build planning/execution, design for manufacturing, test development and outgoing quality. Achieved 97% yields, >90% on-time delivery performance and $8.5M savings via yield improvements, NRE avoidance, pricing reductions & headcount efficiencies.• Administered $110M annual R&D budget for Division GM comprised of 300+ resources, expense & capital. Managed project portfolio and priorities, staffing targets, tracked quarterly actuals, and created project resource sizing model. • Contracted multiple analog integrated circuit suppliers to create 8 power management ASICs for Atom System on Chip architecture through an ecosystem collaboration model. Drove PMIC sourcing strategy and business development, engaging vendor executives with Intel value proposition / market opportunity, solicited RFQs, made selection and secured commitment. Negotiated joint development agreements including; non-disclosure, IP rights, licensing, commercial terms, pricing, qualification, sample supply availability, HVM capacity & supplier deliverable schedules.

Led a team of 20+ program managers, process engineers and planners to fabricate, package, test and distribute Wi-Fi & Wi-Max baseband & radio transceiver chips for Centrino WLAN network cards, manufactured in Intel Fabs and external foundries.• Managed 23 products over 180/130/90/65nm mixed-signal process technology nodes scaled to 60Mu, $120M Revenue/yr.• Sponsored cost reduction delivering $56.5M P&L savings through process/yield optimizations, test time reduction, supplier price negotiation, and capital tool/mask/expedite NRE decreases.• Drove competitive strategy to outsource package development & test to leverage faster, less expensive turnkey suppliers. • Implemented organization infrastructure improvements – program reviews, dash-board indicators, standardized sample through-put model, delivery status WIP reporting, and metric forecasting for capacity modeling.• Built and shipped pre-production sample supply to Intel validation and OEM customers. • Managed quality excursion & MRB containment/screen, failure analysis, root cause, and corrective action.

Started and managed a team of 10+ Program and materials managers responsible for development, manufacture and deployment of Pentium 3m, 4, Centrino & Core Duo laptop CPU and chipset platform reference design motherboards to internal chip validation engineering, software ecosystem developers and OEM/ODM customers as design application tool. Responsible for defining integrated development schedules, supply/demand planning, bill of material procurement, surface mount assembly/test and shipping low scale volume built at Intel’s internal system factories in Asia and US.• Shipped ~10K boards worth $12M/year to100+ customers over several projects meeting on-time performance expectations. • Drove yield increase from 90% to 98% through strengthening design for manufacturing & test debug/repair processes. • Delivered $8.6M savings via efficiency projects –recycling and spares rotation, consumption budget, 3rd party lease contra-revenue, and BOM plus conversion cost reductions.• Implemented business processes to raise operational effectiveness – standardized factory through put time planning model, customer ordering guide aligning demand to design stability, and transition to web-based on-line ordering system.

New product materials lead over 6 generations of notebook processor modules (Pentium I, II, III, & Celeron) ramping development samples into high volume manufacturing. Responsibilities included ensuring bill of material meets quality, availability and cost health objectives over the life cycle and aligned with time-to-market launch.• Drove cost reduction initiatives realizing $75M cumulative saving on $4B annual revenue product line. • Led materials qualification and risk management working group with corporate commodity managers, Q&R, factory engineering to ensure part verification, supplier and product assembly certification meet yield and reliability goals. • Developed integrated component qualification methodology linking specifications, supplier process variation and acceptance testing in design application and board manufacturing. Applied statistical controls to ensure supplier’s processes and quality metrologies are capable and stable to comply with critical spec parameters and meet reliability defect rate goals.• Created materials development and procurement plans mapping product milestones with supplier lead times and recommending optimal supplier selection. Published readiness dashboards communicating risk metrics to Sr. Management.

Purchased electronic part supply for printed circuit board MRP build plans & managed factory inventory control goals.• Implemented $6M/yr, 600 item in-plant, distributor replenishment store saving $1M/yr holding cost & buyer staff downsizing.• Developed automated 80:20 model ordering policy to facilitate cross-plant stock leveling via Excel macro tool.• Analyzed upside simulations to commit build plan changes inside lead time, identify shortages and drive expedite actions.

Designed, fabricated, installed & operated high temperature vitrification equipment to develop treatment technologies for government & industrial chemical & nuclear wastes as a contract R&D service to the U.S. Department of Energy. Duties include:• Created $3M project management plans - Gantt/PERT network scheduling, resource budgets & progress reporting. • Drafted AutoCAD drawings of mechanical equipment, piping systems, power & instrumentation control schematics. • Planned, coordinated & oversaw multi-discipline, construction craft service work-order build execution & facility modification.