Jeffrey Lee received his M.S. degree from Applied Chemistry Department of Taiwan Chiao-Tung University in 1991, and EMBA degree of Chiao-Tung University in 2009. His majors are polymer material physical properties and characterization. Prior to joining iST-Integrated Service Technology Inc, he has worked for ITRI to be researcher about advanced polymer composite in Taiwan from 1993 to 1997, and Siliconix Vishay as Power MOSFET packaging R&D process engineer from 1998 to 1999, and ASE Corp RD to be green program manager since 1999 to 2006. Currently, he is Assistant Vice President in iST-Integrated Service Technology Inc., and main works are to develop global Open Collaboration engineering projects for Semiconductor and ICT related Q&R test verification technology with branding customer and industry alliance. He has published more than 100 technical papers about IC package , PCB assembly and PCB technology on material, process and reliability study in international electronic conference and Journal, also is the inventor of 4 patents and best paper award of SMTA China 2010 and outstanding paper award of ICEPT 2018, as well being awarded IPC distinguished committee member with IPC9709 in 2014 and IPC8921 in 2020 and IPC9701B in 2022,and recently awarded IPC Asia 2023 Distinguished member service award, respectively. And he is also board member of IMAPS Taiwan, technical committee member of IPC, JEDEC, AEC, INEMI, ECTC ,SMTA , IMPACT and TPCA, and 001 CSE of IPC. Currently, he is focusing more on mobile, Telecom and data center,EV related qualification and testing standard development with industry alliance and standard committee, as well as FHE, e-Textile and advanced IC package development .Specialties: 1.Quality & reliability, failure analysis in Semiconductor and ICT Electronics.2. IC Packaging Material / Process Quality & Reliability3.PCB & PCBA quality and reliability4.Polymer composite science in design, process, application and recycling5.International standard development and collaboration.