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Jeff Tackett Email & Phone Number

Senior Principal DSP Engineer at HARMAN International
Location: Farmington, Michigan, United States 9 work roles 2 schools
1 work email found @harman.com LinkedIn matched
✓ Verified May 2026 4 data sources Profile completeness 100%

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Current company
HARMAN International
Role
Senior Principal DSP Engineer
Location
Farmington, Michigan, United States
Company size
28260 employees

Who is Jeff Tackett? Overview

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Quick answer

Jeff Tackett is listed as Senior Principal DSP Engineer at HARMAN International, a company with 28260 employees, based in Farmington, Michigan, United States. AeroLeads shows a work email signal at harman.com and a matched LinkedIn profile for Jeff Tackett.

Jeff Tackett previously worked as Founder at Bfg Cards And More, Llc and Principal DSP Engineer at Harman International. Jeff Tackett holds M.S., Computer Engineering from University Of Michigan-Dearborn.

Company email context

Email format at HARMAN International

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{first}.{last}@harman.com
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Profile bio

About Jeff Tackett

Audio, Signal Processing, Electrical, and Software Engineer with over 20 years of experience in embedded software, DSP algorithm development, production software development, automotive systems, fixed-point design, algorithmic simulation, noise cancellation technologies, and Model-Based Development (MBD).Specialties: Digital signal processing, software architecture design, hardware/software debugging, and production development of automotive systems.

Listed skills include Software Engineering, Dsp, Matlab, Spi, and 25 others.

Current workplace

Jeff Tackett's current company

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HARMAN International
Harman International
Senior Principal DSP Engineer
Farmington, MI, US
Website
harman.com
Employees
28260
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Company profile
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9 roles

Jeff Tackett work experience

A career timeline built from the work history available for this profile.

Founder

Current
Bfg Cards And More, Llc

Selling Marvel Cards on Whatnot and producing unique 3D printed storage solutions.

Sep 2023 - Present

Senior Principal Dsp Engineer

Current
Harman International

Stamford, Connecticut, US

Algorithm Designer for Engine-Order-Cancellation (EOC) Technologies. Focus on simulation technologies using MATLAB to enable rapid proto-typing of new ideas as well as aiding the production team to optimize tunings virtually.

Dec 2020 - Present

Principal Dsp Engineer

Harman International

Stamford, Connecticut, US

Algorithm and software developer in the area of Engine Order Cancelation(EOC) and Engine Sound Synthesis (ESS). Optimized production code to reduce memory/MIPS in order to meet requirements for C66 and A15 DSPs. Extended existing EOC algorithm by leading the design of new products like: Driveline Cancellation, Virtual Mics that maintain performance with.

Aug 2018 - Dec 2020

Senior Software Engineer

Mentor Graphics

Wilsonville, OR, US

Responsible for Active Noise Cancellation(ANC) development project as it applies to both engine order cancellation and road noise cancellation. Regularly meet with customers and the Sales team to discuss possible applications of our ANC technology in a production environment. Improved the reuse of MATLAB code and added many plotting functions to help.

Apr 2016 - Aug 2018

Senior Application Engineer

The Mathworks

Natick, MA, US

Focused on Production Code Generation(PCG) products developed by The MathWorks. Responsible for meeting with customers that were interested in generating C-Code from Simulink and MATLAB projects and demonstrating the capabilities of MathWorks Embedded Code generation products. Regularly developed and presented demo models in person, over WebEX, and via.

Apr 2012 - Apr 2016

Principal Systems Engineer, Acoustic Research

Harman International

Stamford, Connecticut, US

Focused on expediting new and advanced DSP algorithms to the Automotive Audio market. Ported new surround sound algorithm from a prototype project into a production-intent application. Responsible for the software demonstration of new audio technologies in several high profile customer demo vehicles. Also worked on the research and development of my own.

Jun 2011 - Apr 2012

Senior Software Engineer

Harman International

Stamford, Connecticut, US

Lead software engineer for multiple automotive amplifier designs. Responsible for developing embedded software that meets OEM specifications. Successfully led the design team using an agile software development process(Scrum) for the first Toyota high efficiency Class-H amplifier. Developed and implemented more than 90% of all audio signal processing code.

Aug 2005 - May 2011

Dsp Engineer

Visteon

Van Buren Township, MI, US

Responsible for the testing and design of several production Telematics and Family Entertainment systems. These systems included a rear seat DVD Player for GM/Chrysler, a surround sound headphone application, and a Bluetooth handsfree module for Nissan. In this role I handled the design of both hardware and software in all phases of the development process.

May 2001 - Aug 2005
Team & coworkers

Colleagues at HARMAN International

Other employees you can reach at harman.com. View company contacts for 28260 employees →

AS Abhijith Suryanarayana Abhijith Suryanarayana Colleague at Harman International Bengaluru, Karnataka, India, India View → CH Cathy Habi Cathy Habi Colleague at Harman International Simi Valley, California, United States, United States View → FC Francisco Camacho Francisco Camacho Colleague at Harman International Querétaro, Mexico, Mexico View → SC Shain Chmura Shain Chmura Colleague at Harman International Detroit Metropolitan Area, United States View → DK Dileep Kondaveeti Dileep Kondaveeti Colleague at Harman International Chennai, Tamil Nadu, India, India View → SP Sandesh Pai Sandesh Pai Colleague at Harman International Bengaluru, Karnataka, India, India View → LK Liam Kelly Liam Kelly Colleague at Harman International Royal Oak, Michigan, United States, United States View → AT Akanksha Tripathi Akanksha Tripathi Colleague at Harman International Gurugram, Haryana, India, India View → RS Raman Shinde Raman Shinde Colleague at Harman International Pune, Maharashtra, India, India View → ZR Zulema Rincon Zulema Rincon Colleague at Harman International Aguascalientes, Mexico, Mexico View →
2 education records

Jeff Tackett education

M.S., Computer Engineering

University Of Michigan-Dearborn

Bs, Computer Engineering

Lawrence Technological University
FAQ

Frequently asked questions about Jeff Tackett

Quick answers generated from the profile data available on this page.

What company does Jeff Tackett work for?

Jeff Tackett works for HARMAN International.

What is Jeff Tackett's role at HARMAN International?

Jeff Tackett is listed as Senior Principal DSP Engineer at HARMAN International.

What is Jeff Tackett's email address?

AeroLeads has found 1 work email signal at @harman.com for Jeff Tackett at HARMAN International.

Where is Jeff Tackett based?

Jeff Tackett is based in Farmington, Michigan, United States while working with HARMAN International.

What companies has Jeff Tackett worked for?

Jeff Tackett has worked for Harman International, Bfg Cards And More, Llc, Mentor Graphics, The Mathworks, and Visteon.

Who are Jeff Tackett's colleagues at HARMAN International?

Jeff Tackett's colleagues at HARMAN International include Abhijith Suryanarayana, Cathy Habi, Francisco Camacho, Shain Chmura, and Dileep Kondaveeti.

How can I contact Jeff Tackett?

You can use AeroLeads to view verified contact signals for Jeff Tackett at HARMAN International, including work email, phone, and LinkedIn data when available.

What schools did Jeff Tackett attend?

Jeff Tackett holds M.S., Computer Engineering from University Of Michigan-Dearborn.

What skills is Jeff Tackett known for?

Jeff Tackett is listed with skills including Software Engineering, Dsp, Matlab, Spi, I2C, Tdm, I2S, and C.

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