A member of the executive team reporting to CEO. BU P&L responsibility and the head of the APAC region. Managing a global business providing power semiconductor packaging substrate, RF PCB laminate materials and interconnect solutions for Electric Vehicles (EV), Renewable Energy, ADAS, telecom, Industrial and Aerospace & Defense applications. Providing APAC regional leadership to ensure smooth operation, promote growth investments, conduct government affairs and inform HQ and the board on enterprise risk management. 25+ years of industry experience across the electronics industry value chain, managing both electronic component and materials businesses, for B2B fortune 500 and mid to large cap public companies, and a B2C startup. Strong track record in turning around underperforming businesses and achieving organic growth beyond market. Proven ability to develop and execute strategic vision, build and lead global cross-functional teams, drive transformation and optimize business processes to enhance performance and profitability. Adept at managing geographically dispersed teams to deliver results and achieve business objectives. Deep understanding of international markets and culture with assignments in Asia and Europe.Specialties: Broad knowledge of the semiconductor and power electronics industry, strategic planning, strategy development, sales excellence, operational excellence, building teams, change management, business process improvement, strategic marketing and business development. Fluent in written and spoken Chinese.
Listed skills include Product Management, Competitive Analysis, Product Development, Business Development, and 13 others.