Senior Rf Engineer
CurrentI Joined in SonyEricsson in 2007 and then in SONY Mobile. I have joined in many TDD_FDD 4G/3G/2G multiband projects. I am very familiar with Qualcomm platform, phone HW designs and also some simple Platform and Baseband knowledge . Be familiar with Phone RF related TA test procedure and preparation work. Can solve many problems encountered in projects.Projects experience:Leo BJ: 2014 Qualcomm platform CSFB(4G project China Unicom,CMCC,Global Dual SIM card)As Design leader role until project finish, pass all TA,and launch to market, response all RF related things and issues coordination and TA coordination. And in charge of NFC debug and TA (including CMCC, China Unicom, CMW, Master Card, Visa TA), Support TDD high band debug. TianChi: Qualcomm platform, CMCC 4G Project, join in the later stage. I am responsible for TDD LTE B38, 40, 41 3 Bands, with APT power saving function.Honami: Qualcomm platform, SGLTECMCC Join Schematic design,PCB layout, platform RF small board Bring up,Join in WLAN, TDD FDD LTE, GSM Co-existence research,responsible for TDD LTE B38, 40, 41 3 high frequency Bands.Huashan xin: Qualcomm platform, China telecom project Dual GSM Design,Responsible for single chip GSM 4 Bands,Begin with PCB Layout,Due to platform is new and single chip DC included design,have faced many GMSK/8psk calibration problems 校准和and RF performance decrease because of DC noise. Join LTE, WLAN, GSM Co-existence discussion.Tubasa Xin: The first CDMA phone in SONY BJ,support BT-WiFi.Pitaya: Responsible for Qualcomm first BT-WiFi chip part.Ericsson platform projects: Join some projects, including GSM和UMTS, GPS, BT-WiFi(TI) development,Layout check,conductive and EMC Debug.