Jerome Albert Email and Phone Number
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Semiconductor leader with extensive SoC experience. Successfully taped out more than 20 chips down to the latest technology node, across multiple markets: server / networking / embedded / custom ASICs. Build / Led and Manage teams across geographies: Europe / Asia / Americas, resolving resource conflicts, meeting milestones across multiple programs in parallel.
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Group Director Of Engineering (Svg)Cadence Design Systems Sep 2019 - PresentSan Jose, California, UsAbsolutely thrilled to discuss what we've been cooking here at HSV... Palladium Z3 platform offers 2X+ capacity over prior product generations, lot of hours have gone into taking this little beast from architectural concept all the way through production. This is the fruit of a collaboration across all Cadence Business Units involving 100s of hard working and passionate engineers working together to assemble this custom crafted ASIC packing lot of transistors and embedded macros...Really proud of all the team here. -
Technology Leader Samsung Foundry (Fds)Samsung Foundry Apr 2019 - Sep 2019As part of the Samsung Foundry FDS (Foundry Design Services) team, promoting Samsung technology to external customers, developing partnership with IP vendors to strengthen Samsung ecosystem, working on multiple programs across industry segments: automotive / networking / consumer. Helping clients build their solutions from architecture definition to tapeout (SOW / RFI / RFQ). -
Technology Leader (Asic Datacenter Networking)Cisco Aug 2018 - Apr 2019San Jose, Ca, UsPartitionning / Clocking and Top Level RTL Integration on next Nexus 9K platform (25.6T / 12.8T) using a Fully Abutted / Physical Aware approach. Floorplan based Feedthrough insertion / Latency Matching / Chiplet Integration through D2D Interconnect. -
Senior Engineering Manager (Qualcomm Datacenter Technologies)Qualcomm Apr 2015 - Aug 2018San Diego, Ca, Us7nm Server Tape out. Largest device ever produced at Qualcomm: 16 x 4 PCIe Lanes / 82 Custom ARM Cores built around a mesh structure / 8 DDR Channels.Chip to Chip Interconnect: A Low latency Point to Point interconnect targeting dual sockets applications. SoC Timing Closure on Centriq 2400 Server Processor family: first 10nm ARM based Server packing up to 48 custom cores / distributed L3 Cache / Segmented Ring Interconnect / 6 DDR4 Channels / 32 PCIE Gen3 lanes and much more... -
Engineering ManagerAppliedmicro Dec 2010 - Apr 2015Santa Clara, Ca, UsBuild the SoC STA team from the ground up: hiring and mentoring junior and senior individuals to perform their duties.Responsible for X-Weave / X-Gene timing closure. X-Weave is a 12x10Gbps LAN / WAN / OTN Framer Mapper device with built in FEC to satisfy the growing datacenter connectivity requirements. X-Gene solution is the first ARM64 (ARM v8.0) based Server on a Chip integrating all the interfaces present in the datacenter (compute / storage / networking / security)Developed top and blocks timing constraints across all mode / Performed timing closure across all corners. Responsible for flow development / automation. - Physical aware timing ECOs / Recovery. - Physical aware I/O budgeting. - Constraints Analyzer and Checker. - Cross Domain Check. -
Staff Design EngineerAppliedmicro Nov 2004 - Dec 2010Santa Clara, Ca, UsDeveloped top and blocks timing constraints on Packet Pro SoC based family.Timing closure across all major interfaces: - DDR2 / DDR3 up to 1600 Mbps. - PCIE / SATA / XFI / USB. -
Senior Design EngineerIbm Oct 2001 - Dec 2004Armonk, New York, Ny, UsHardware validation engineer on Power PC based SoC. Bring up using JTAG processor probe. Linux module development. Customer support. Verification lead over Packet Routing Switch fabric products.Verification was using a data centric environment based on VHDL adapter models and a C/C++ frames generation and checking tool (traffic flow integrity and flow control functions checking). -
Ic Design EngineerTexas Instruments Jul 2000 - Oct 2001Dallas, Tx, UsSynthesis scripts development part of TI OMAP platform. Performed Gate level simulation as well ATPG test patterns development.
Jerome Albert Skills
Jerome Albert Education Details
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Esiee ParisElectrical And Electronics Engineering
Frequently Asked Questions about Jerome Albert
What company does Jerome Albert work for?
Jerome Albert works for Cadence Design Systems
What is Jerome Albert's role at the current company?
Jerome Albert's current role is Group Director of Engineering Cadence Design Systems (SVG).
What is Jerome Albert's email address?
Jerome Albert's email address is je****@****ail.com
What is Jerome Albert's direct phone number?
Jerome Albert's direct phone number is +1 408-542*****
What schools did Jerome Albert attend?
Jerome Albert attended Esiee Paris.
What skills is Jerome Albert known for?
Jerome Albert has skills like Asic, Soc, Timing Closure, Static Timing Analysis, Vhdl, Eda, Semiconductors, Embedded Systems, Ic, Verilog, Processors, Rtl Design.
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