Jerry B

Jerry B Email and Phone Number

IC Assembly Engineer @ Silitronics Solutions Inc
Napa, CA, US
Jerry B's Location
Napa, California, United States, United States
About Jerry B

23 years of experience in IC Assembly Front of Line Manufacturing OperationSpecialties: 1) Aluminum Wire Bonding - 45/60 degree wire feed Small wire, 90-degree deep access bonding Small wire, and Wire Bonding Aluminum Heavy Wire. 2) Auto Vision Inspection after Die Bonding & after Wire Bonding process - 2D/3D inspection. 3) Die Attach (Die Bonding) -Soft Solder operation4) Gold ball wire bonding

Jerry B's Current Company Details
Silitronics Solutions Inc

Silitronics Solutions Inc

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IC Assembly Engineer
Napa, CA, US
Jerry B Work Experience Details
  • Silitronics Solutions Inc
    Ic Assembly Engineer
    Silitronics Solutions Inc
    Napa, Ca, Us
  • Magna International
    Senior Process Engineer
    Magna International Aug 2023 - Oct 2024
    Goleta, California, United States
    >Responsible supporting Assembly Yield improvement for Night Vision Camera.>Support startup pre-machine buy-off/setup at supplier site – Die Bond BESI Datacon, Aluminum WireBond Delvotec F&K and MVP AutoVision inspection for Night Vision Next Generation Camera.
  • Te Connectivity
    Staff Manufacturing And Process Development Engineer Wire Bonding
    Te Connectivity Jun 2016 - Jan 2023
    Gyeongsan, North Gyeongsang, South Korea
    • Responsible startup for Middle Pressure Sensors (MPS) / High Pressure Sensors (HPS) Assembly process Plasma - Aluminum Wire Bonding (90-degree deep access/60-degree feed)-Wire bonding inspection process development testing to high volume production.• Create, perform and analyze Design Of Experiments-minitab for development & sustaining activities.• Interface with all levels of engineering in the development of new ideas / project for wire bonding.• Work effectively with all level of organization including wire bond machine suppliers.• Investigate wire bonding process problems and wire bonding design problems, perform Root Cause Analysis / plan out Corrective Actions/Preventive Actions. 8D / 3X5 why analysis, 6 Sigma methodology.• Support customer audits of production line equipment, tooling, documentation.• Develop process documentation including working instructions/ SPC/ GR&R, FMEA (Failure Mode Effect Analysis) / Control Plan / wire bond design rules and wire bond troubleshooting guidelines.• Participate in the evaluation test wire bond equipment, wire bond tooling and wire bond direct material.• Support improvement projects to reduce cycle time, reduce wire bond defects and manufacturing cost.
  • Infineon Technologies
    Senior Process Wire Bonding And Autovision Engineer
    Infineon Technologies May 2004 - Apr 2016
    Batam, Riau Islands, Indonesia
    • Line sustaining support production Aluminum Wire bonding Heavy / Small wire, 2D/3D Auto Vision inspection – DSO /Power DSO automotive devices.• Investigate wire bonding process problems and wire bonding design problems, perform Root Cause Analysis / plan out Corrective Actions/Preventive Actions. 8D / 3X5 why analysis, 6 Sigma methodology.• Conduct training FMEA to Managers, Engineers, Supervisors and other departments.• Participate in the evaluation test wire bond equipment, wire bond tooling and wire bond direct material.• Support improvement projects to reduce cycle time, reduce wire bond defects and manufacturing cost.• Support customer audits of production line equipment, tooling, documentation.• Develop process documentation including working instructions/ SPC/ GR&R, FMEA (Failure Mode Effect Analysis) / Control Plan / wire bond design rules and wire bond troubleshooting guidelines.• Support 6 Sigma Greenbelt projects.• Support new product development from testing development to operations.• Conduct regular review Process parameter for Cpk improvement.• Drive a cross-functional team to address production quality issues.• Respond to Customer complaints effectively through the formulated corrective/preventive actions.• Participate Innovation & Quality Circles Convention, Wire Bond excellence program and Zero-Defect program for quality improvements.
  • Psi Technologies
    Process Engineer Alu Wire Bonding / Soft Solder Die Attach
    Psi Technologies Dec 2002 - May 2004
    Metro Manila, National Capital Region, Philippines
    Support assembly front of line production (Alu wire bonding / Die attach process) as Line Sustaining Engineer for quality, productivity and cycle time improvement.Perform investigation to determine root causes and establish corrective/preventive actions for Wire bonding and Die Attach related defects.
  • Automated Technology (Phil.) Inc. - Atec
    Process Engineer Aluminum Wire Bonding / Die Attach Soft Solder
    Automated Technology (Phil.) Inc. - Atec May 2000 - Dec 2002
    Laguna, Calabarzon, Philippines
    Startup Assembly front of line Aluminum Wire bonding and Die attach soft solder for Power TO devices - International Rectifier.Support production to conduct investigation on problematic device / lot and provide lot disposition.Direct support machine maintenance - troubleshooting and machine parts regular replacement.
  • Psi Technologies
    Process Technician Aluminum Wire Bonding And Die Attach Soft Solder
    Psi Technologies Mar 1999 - May 2000
    Metro Manila, National Capital Region, Philippines
    Support production to conduct investigation on problematic device / lot and provide lot disposition.Direct support engineering lot build and special customer order build.

Jerry B Education Details

Frequently Asked Questions about Jerry B

What company does Jerry B work for?

Jerry B works for Silitronics Solutions Inc

What is Jerry B's role at the current company?

Jerry B's current role is IC Assembly Engineer.

What schools did Jerry B attend?

Jerry B attended Rizal Technological University.

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