Creating an automation framework for company wide integration, validation and verification.

• Encapsulated chromium and scale inhibitors within nanocapsules using both a single and double emulsion process for the purpose of enhancing oil recovery for Shell Corp. and AEC • Designed and carried out experiments to increase capsule entrapment efficiency from 1% to about 20%, as well as an increase in cargo concentration • Analyzed various physical properties of nanocapsules using inductively coupled plasma (ICP), mass spectroscopy, dynamic light scattering (DLS), UV-Visible spectroscopy, and ultrasonication• Studied the release time, gelation time, and colloidal stability of the nanocapsules for industrial practicality

• Performed advanced failure analysis for NAND and 3DXPoint packages; analyzed wire bond intermetallic compound (IMC) and under bond pad structures by cross-section and visual inspection; successfully established wire bond integrity baseline for 3DXPoint packages • Assisted in preconditioning and reflow to test solder extrusion mitigation for over 18,000 units; gated the beginning of high-volume manufacturing of a new system in package (SiP) product• Used JMP and Excel to summarize and analyze large amounts of electrical validation testing data and proposed new test limits for the second wave screening test• Designed new biased highly accelerated stress test (BHAST) boards to test 160 third generation 3DXPoint units for the purpose of studying wire bond assembly forces on different active metal layers • Fostered collaboration and professional communication skills through working in a large corporation environment