Hello! I am a first year Master's student in Photonics at UCSD. Looking for a summer internship in 2024 and full-time employment afterwards.Check out a program I'm making to help students explore Fraunhofer Diffraction and the 2D FFT here: github.com/Jerry9099/2D-Fourier-Game_4.2 https://www.ee.ucla.edu/fast-track-program/ (you can find me in profiles --> class of 2023)Key experiences include a Product Engineering internship at Texas Instruments, working as an undergraduate researcher in the CHIPS Lab at UCLA. Writing a Design Rule Check for their Silicon Interconnect Fabric. https://www.chips.ucla.edu/research/project/4, and IEEE Micromouse and Baja SAE.The latter have given me experience designing PCB's in Eagle (schematic and layout) through IEEE's Micromouse competition. Also programmed in C for the STM32 microcontroller and have general proficient skill in C++.Wide open to all opportunities, but interested in photonics, medical, semiconductor, and automotive fields in particular. Interests in photonics, signal processing, semiconductors, data science, and machine learning.Please message me on LinkedIn if you have any questions!
Ansys Zemax Opticstudio
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Personal ProjectAnsys Zemax Opticstudio Aug 2024 - Present• Recreation of a standard smartphone imaging lens setup • Analysis of lens elements such as 1st order/2nd order effects, aberration correction including coma, spherical, chromatic – wavefront and MTF analysis – manufacturing tolerances
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Optical Link TesterPaul Yu Lab Nov 2023 - Jun 2024UcsdCharacterizing the temperature performance variation of a photonic link, comprising a low noise laser, a fiber amplifier, and a high-speed photodiode for analog signal transmission.
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Undergraduate Researcher - Ucla Chips (Center For Heterogeneous Integration And Performance Scaling)Ucla Henry Samueli School Of Engineering And Applied Science Sep 2020 - Jul 2023CHIPS Si-IF has 20+ paper publications in the last 5 years, received $300k NIST funding in 2022 for heterogeneous packaging research and articles from both New York Times and IEEE SpectrumSilicon Interconnect Fabric (Si-IF) Team – a 2-10 µm pitch silicon interconnect platform that allows integration of heterogeneous dielets ---- DRC ensures that a virtual design can be manufactured• Coding a Calibre SVRF Design Rule Check (DRC) for Si-IF, check designs in Cadence Virtuoso • Designed set of 16 modular designs to validate DRC rules• 48 out of 50 DRC rules implemented and validated• Collaboration with grad student to keep rules updated and revise existing ones -
Student - Semiconductor Manufacturing Capstone ProjectUcla Henry Samueli School Of Engineering And Applied Science Jan 2023 - Jun 2023Ucla Nanolab- manufactured single-layer 1um CMOS process from start to finish- simulated devices of various sizes and designs in TSuprem4 and analyzed impacts on performance- obtained in-depth understanding of semiconductor manufacturing process, including oxide growth, photomasking, lithography, alignment, implantation, deposition, etching, , etc.- characterized and analyzed finished product, including NMOS, BJT, MOSCAP, etc.
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Baja Sae Ecvt Team (Electronic Continuously Variable Transmission)Bruin Racing Jul 2020 - Jun 2023• Calibrated and debugged Odrive motor driver for ECVT actuation• Programming PD control code to be run on Teensy MCU• Performed data visualization and Fourier analysis to determine optimal digital filtering for sensor data -
Product Engineering InternTexas Instruments Jun 2022 - Sep 2022• Converted a testing solution from ETS 364 to ETS 88 – projected savings ~$50,000 annually – full documentation and verification process• Solved production yield issue - analyzed lot data, identified cause, and implemented fix• Handled customer return – verification of failure mode, investigation into root cause –collaboration with coworkers to narrow investigation scope -
Ti Line Following RobotTexas Instruments Sep 2020 - Dec 2020• Programmed robot with IR sensors and TI msp430 MCU • Extensively tuned PD control to complete a test course as fast as possible• Debugged plethora of problems – from quality of printed track to delays in code
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Supermilage Vehicle Powertrain SystemBruin Racing Sep 2019 - Mar 2020Powertrain Team- Soldered surface mount components for motor driver- Implemented new design (wiring, crimping)- Helped debug in-house motor driver for 36V BLDC motor
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Student MemberIeee Sep 2019 - Mar 2020Micromouse ProjectClosely collaborate on a team of 3 to design, construct, code, and test a small robot thatautonomously solves mazes- Designed PCB (schematic and board) using Eagle software and programmed robot withSTM32Cube IDE (C) (embedded systems)- Soldered surface mount components, wrote PID for motor controllers- Design based on existing components was very successful, self-designed PCB could not betested due to pandemic
Jerry Ding Education Details
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Electrical And Electronics Engineering -
Electrical And Electronics Engineering
Frequently Asked Questions about Jerry Ding
What company does Jerry Ding work for?
Jerry Ding works for Ansys Zemax Opticstudio
What is Jerry Ding's role at the current company?
Jerry Ding's current role is Master's in Photonics/Medical Devices student at UCSD.
What schools did Jerry Ding attend?
Jerry Ding attended Uc San Diego, University Of California, Los Angeles.
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