Responsibilities:1. 28nm LP process development and engagement: Process, device development, process inline/offline control system set up, NPI and production control 2. 40nm RF process engagement: cross-fab process comparison and matching by process tweak. NPI handle and production control.3. Mature process production line management: Product yield improvement, quality and reliability control, process abnormal handle and related material disposition… Show more Responsibilities:1. 28nm LP process development and engagement: Process, device development, process inline/offline control system set up, NPI and production control 2. 40nm RF process engagement: cross-fab process comparison and matching by process tweak. NPI handle and production control.3. Mature process production line management: Product yield improvement, quality and reliability control, process abnormal handle and related material disposition. Achievements:1. Successfully bring up SMIC 28nm LP process: all critical parameters meet Qualcomm request, >6 products successfully NPI and production with yield and quality match to word wide leading performance. 2. Successfully bring up SMIC 40nm LP process: all critical parameters meet Qualcomm request. 3. Successfully handled and maintained over 15 products’ production: improved the yield with word class quality performance. No quality escape issue happened on all of the process abnormal handled and disposed by me. Show less

Responsibilities:1. Maintain, optimize MOS segment process and device performance to continue improve FAB manufacture productivity, yield, quality and reliability. 2. Drive and plan related process control, In-line control and inspection plan to continue the process uniformity improvement. Make sure the health of the manufacture line3. IC product MOS device failure analysis: statistics analysis, electric parameters correlation analysis, physics structure and elements analysis… Show more Responsibilities:1. Maintain, optimize MOS segment process and device performance to continue improve FAB manufacture productivity, yield, quality and reliability. 2. Drive and plan related process control, In-line control and inspection plan to continue the process uniformity improvement. Make sure the health of the manufacture line3. IC product MOS device failure analysis: statistics analysis, electric parameters correlation analysis, physics structure and elements analysis. 4. Design experiment and analyze data to identify and resolve all process and device related issues.5. Design test plan and analyze data to dispo and evaluation the abnormal materials.6. Co-work with yield engineer to continue improvement the yield. Show less

Responsibilities:1. Analysis, monitor, control and enhance the probing yield, prevent and dig out the root cause of defects which from manufacture process or product design that depress yields, to ensure the manufacture line is health for yield.2. New product Introduction and production. Design rule validation, device window check, elimination major yield detractors at NTO initial stage.