Jim Dai work email
- Valid
Jim Dai personal email
• Professional Experience: More than ten years’ extensive industrial experience with embedded system development, automotive system design, multi-processor system design and test, wireless communication development, analog/digital/RF hardware design, EMI/EMC compliance testing, Linux device driver and application development.• Technical Skills: (1) Expertise in high speed protocols such as CAN, FPD-Link III, GMSL, PCI Express, USB, SATA, TCP/IP, A2B, I2S. (2) In-depth knowledge of ECU, FPGA/ARM hardware design, automotive electronics, firmware and application development, functional safety. (3) Solid knowledge in high speed PCB design, microwave electronic circuit, CMOS and RF technology.(4) Strong background in electromagnetic theory, RF and Communication, transmission line, signal and power integrity, crosstalk, ground bounce, jitter and simultaneous switching noise (SSN) analysis.(5) Broad experience in wireless communication with WI-FI, Bluetooth/BLE, RF, IoT, network access device (NAD). • Mathematic Simulation/Modeling: Matlab, Simulink, Ansoft HFSS, Ansoft Designer, Maxwell 2D field simulator, COSMOL Multiphysics (2D/3D electromagnetic simulator).• Measuring/Testing: Network/Spectrum Analyzer, Digital Oscilloscope, Time Domain Reflectometer.• Circuit Design/Simulation: Altium Designer, Mentor Graphics Xpedition, QuestaSim/ModelSim, Cadence, Vivado simulator for FPGA simulation, PSPICE circuit analysis. • Programming/Scripting: C/C++, VHDL/Verilog, Java, Tcl/Tk, Python, Shell (Bash), Assembly language.• Strong verbal and written skills in both English and Chinese.
-
Senior Hardware Design LeadGeneral Motors Apr 2021 - PresentDetroit, Michigan, Us -
Hardware Engineer SpecialistValeo Nov 2017 - Apr 2021Paris, Île-De-France, Fr• Led the design of telematics system based on NXP i.MX8 processor, dedicated short-range communication (DSRC) and cellular vehicle-to-everything (C-V2X) single chip modem, NAD, GNSS, CODEC, WI-FI, Bluetooth. • Prototyped high precision GNSS positioning system with multi-band GNSS, IMU, RTK correction for automated car, lane navigation and V2X applications (demoed in CES 2020). • Analyzed the RF signal of V2X and conducted preliminary regulatory certification with spectrum and network analyzers. Tested communication range of real V2X systems to determine the system satisfaction of range standard.• Worked on variety of RFI/RFQ (hardware architecture, requirements deliverability, etc). Generated bill of materials (BOM) and conducted the budgetary cost calculation for assuring business success. • Developed template tool for RF path power budget estimation to coordinate the system design for meeting the RF range and power standards.• Implemented RF and LF signal relay attack system for demonstrating the functional defect of remote car key fob. -
Senior Hardware EngineerAutoliv Sep 2016 - Nov 2017Stockholm, Se• Managed the design of Advanced Driver Assistant System (ADAS) central ECU system based on Xilinx Zynq UltraScale+ MPSoC and Infineon Aurix microprocessor. Verified individual system functionalities (FPD-Link III, GMSL, SD, CAN, Ethernet, PCIe, I2C).• Implemented real-time FFT processing of raw radar data in FPGA and transmitted the result (through DMA) to LPDDR4 for further processing with ARM cores (both FPGA and ARM cores are in Xilinx UltraScale+ MPSoC). • Designed FPGA simulation system using Xilinx Vivado software. Created multiple radar and camera simulation data based on CSI-2 protocol for expediting real system development.• Converted radar AD results to CSI-2 format using Lattice CrossLink FPGA. Generated real test pattern inside FPGA for system level verification and functional safety. -
Senior Hardware EngineerA&D Technology Mar 2012 - Sep 2016Ann Arbor, Mi, Us• Designed FPGA and ARM (Xilinx Zynq) based high-speed acquisition and real-time data processing system. Implemented FPGA programming architecture using AXI interface, DMA, FIFO for high speed applications. Developed Ethernet, SD, USB, UART, CAN standard interfaces for OS, data storage and communications.• Developed standard PCI Express extension card over optical fiber or metal cable based on PCI express switch and Altera FPGA. Designed FPGA firmware which included PCI express, Serial Lite II IPs for high speed data communication. Developed Linux device drive and application for data communication (through DMA) bandwidth, latency verification.• Researched on bandwidth and latency of multi-systems data sharing. The communication among systems is through fiber optical PCI express using non-transparent PCI express technology. Real-time Linux (Xenomai) driver and application were developed for bandwidth and latency measurement. • Designed high power (100V, 5A per channel, total 16 channels) H-bridge motor drive module board. Developed fast response analog over-current protection circuit for motor protection. Created Simulink module for application usage. -
Hardware EngineerA&D Technology Oct 2008 - Mar 2012Ann Arbor, Mi, Us• Researched on high precision battery cycling test. Developed PID control algorithm for both temperature (Thermal Chamber) and battery cycler current to improve the battery discharge/charge precision by using low-precision battery cycler.• Managed multi-processor (eight AMD processors with four cores each) system EMC testing. Coordinated customized heatsink due to limited space. Designed function evaluated board (based on Xilinx Spartan FPGA), including Linux device driver and application development.• Designed de-serialization board based on Altera Cyclone III FPGA for interpolating Intel Low Pin Count (LPC) protocol. Supplied interface connection to logic analyzer and communication to PC through USB for intensive debugging.
-
Hardware Engineer InternLinkquest Inc. May 2008 - Aug 2008• Prototyped USB Data logger system based on ARM, FLASH and SRAM memories. Implemented the schematic capture and PCB layout for this system.
-
Research AssistantThe University Of Akron Jan 2004 - Apr 2008Akron, Oh, Us• Investigated electromagnetic field enhancement (GHz range) in optical nanolenses by simulating metallic cascade spherical particles with HFSS. Researched the effects to the electromagnetic field of substrate (SiO2) in bottom of nanolenses structure. • Designed 3D multilayer model of protein-solvent system for analyzing electrostatic fields. Applied innovative numerical method to the model and achieved better accuracy compared with finite element method (FEM) and finite different (FD) method. -
Electrical Hardware EngineerNanjing Jinka Intelligent Electric Appliance Ltd. Jul 1997 - Jun 1999• Designed three-phase intelligent electricity meter. Implemented the transition from traditional mechanical electricity meter to intelligent electricity meter by using microprocessor.
Jim Dai Education Details
-
The University Of AkronElectrical And Computer Engineering -
University Of Tennessee, KnoxvilleBiological/Biosystems Engineering
-
Huazhong University Of Science And TechnologyElectrical Engineering
-
Huazhong University Of Science And TechnologyElectrical Engineering
Frequently Asked Questions about Jim Dai
What company does Jim Dai work for?
Jim Dai works for General Motors
What is Jim Dai's role at the current company?
Jim Dai's current role is Senior Hardware Design Lead at General Motors.
What is Jim Dai's email address?
Jim Dai's email address is ji****@****leo.com
What schools did Jim Dai attend?
Jim Dai attended The University Of Akron, University Of Tennessee, Knoxville, Huazhong University Of Science And Technology, Huazhong University Of Science And Technology.
Free Chrome Extension
Find emails, phones & company data instantly
Aero Online
Your AI prospecting assistant
Select data to include:
0 records × $0.02 per record
Download 750 million emails and 100 million phone numbers
Access emails and phone numbers of over 750 million business users. Instantly download verified profiles using 20+ filters, including location, job title, company, function, and industry.
Start your free trial