Staff Process Engineer
Responsible for developing the world's first chip inductors featuring a thin core (20µm or less), fine pitch (Line/Space: 15µm/7µm), and high aspect ratio (AR 6.0 or 7.0).Development of the Modified Semi-Additive Process (MSAP) and One-Path Laminating Process to solve the inefficiency of the existing sintering process and dramatically simplify the process.