Senior Mechanical Engineer
CurrentUtilizing Pogo pin technology to create test platforms for customers in the USA and Asia.Design production/bench top sockets for BGA/LGA, PGA, QFP, QFN, SOIC devices with pitch ranging from 0.25mm to 2+mm. Open top and clamshell varieties.Design Probe head for wafer level testing (prober) and hand test for bench top WLCSP set up, w/ ThermoStream compatibility.Design Pogo pin/socket development for high-speed applications including coaxial sockets. Cost-effective sockets for Burn-In/HTOL and Open-Short tests.