Utilizing Pogo pin technology to create test platforms for customers in the USA and Asia.Design production/bench top sockets for BGA/LGA, PGA, QFP, QFN, SOIC devices with pitch ranging from 0.25mm to 2+mm. Open top and clamshell varieties.Design Probe head for wafer level testing (prober) and hand test for bench top WLCSP set up, w/ ThermoStream compatibility.Design Pogo pin/socket development for high-speed applications including coaxial sockets. Cost-effective sockets for Burn-In/HTOL and Open-Short tests.

Responsibilities include engineering support for new product introduction.Create operational manufacturing specification documents.Release mechanical parts and assembling procedures through ECO process.Document and release various test procedures and provide hands on support for prototype validation. Coordinate projects and communicate design changes with product engineering, manufacturing, procurement, and program management.

Responsibilities include ongoing engineering support for the Mosir950 and MicroVista scientific low light NIR imaging cameras.Created engineering specification documents and operational proceduresWorked with manufacturing on product re-designs to support efforts to streamline parts, production process, and touch time. Assisted in the reduction of material cost and higher yields to increase margin.Assisted manufacturing in assembling and trouble shooting deliverables.Performed thermal testing on prototype sensor modules.Involvement in various United States military projects from concept development to delivery.Designed parts and components to support new product lines including multi-layer ceramic packages, PCBA, cable/wire harnesses, sensor modules and cameras.Designed production tools and manufacturing process flows to support new product releases.Facilitated the training of technicians on building and assembling new products.Built and troubleshot pre-production deliverable cameras. Designed test fixtures for various PCBA, sensor modules and cameras.Designed and built ESS test array for multiple sensors.