1) Experienced in embedded hardware high speed design process.2) Experienced in RF design process.3) Experienced in embedded hardware testing process.4) Experience in Layout guidelines and involved in EMI/EMC and Reliability Testing.5) Involved in most of the phases of Product development life cycle.6) Excellent documentation skills.Technical skill-set-Hands on ExperienceProcessors & SoC• NXP - I.MX8M• Renesas - RZ G1C• Intel - ARRIA 10 SoC & FPGA, MAX10 FPGA• Xilinx - Zynq Ultrascale+ SOCInterfaces• DDR3, DDR4, NAND, eMMC, Micro SD• Gigabit Ethernet, SATA, PCIe, USB2.0, USB3.0, USB-OTG• HDMI Display, DP Display• SDI Camera• UART, I2C, SPI• WiFi and Bluetooth Interface (Modules)• Debug Interface (JTAG & UART)• QSFP+, FireFly, FMC, FMC+, Pmod, SFP+• Switching Buck, Boost Converters/Controllers, LDOs, PMIC• Power and Driver Amplifiers, Directional and Hybrid Couplers, Filters (LPF, HPF, BPF), CirculatorsTesting• Hardware Design and Interface Testing• EMI/EMC Testing• Reliability TestingTools/Equipments• OrCAD Schematics Capture• Allegro PCB Viewer• Gerber Viewer• Falstad circuit simulator• Arduino IDE• Eagle(Autodesk)• Microsoft Office Tools (PowerPoint, Word, Excel)• CoralDRAW Graphics Suit• CRO, Multi-meter, Soldering, Thermal Camera, Thermal Chamber, Function generator