Juergen Leib Email and Phone Number
Juergen Leib work email
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Juergen Leib personal email
Bring Technology from PowerPoint to ProductionEntrepreneurial leadership of technology driven, intercultural teamsBusiness development and creation of opportunities around the globeTechnical Focus on Advanced Packaging incl. WLP-CSP / TSV for Optical Sensors incl. image sensorsHybrid integration of power semiconductor packages and modules focussing on SiC and GaN
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Group ManagerFraunhofer Iisb Jan 2017 - PresentErlangen, Bavaria, GermanyInvestigation of lifetime aspects of power electronic components and power systems with my 10++ pax team using simulation and/or lifetime tests as research or service. This includes qualification-testing acc. to AQG324, reverse engineering, analytics, test and design. -
Senior ScientistFraunhofer Iisb Jan 2017 - PresentErlangen Area, GermanyAdvanced Packaging and Reliabilty of Power Semiconductors - Components and Systems - incl. Active Power Cycling (PCT), Modelling and Test:Si, SiC and GaN Diodes and MOSFETs; substrates; passive components incl. connectors; modules and systems -
Technology ConsultantConsil Jun 2006 - PresentTechnology and Strategic Consultants for wafer-level-packaging and TSV. We support IP and business development, process integration and production ramp-up worldwide. Our special focus are optical devices and MEMS esp. via-last TSV for image sensors for mobile application.
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Co-FounderClub Yachting Ltd. May 2014 - PresentBritish Virgin IslandsLuxury Yacht-Charter and Kite-Cruises in the Aegaen Sea (Apr - Oct) and the Bahamas (Dec - Mar) operated under waterproofworld.de clubdabaia.com
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Co-Founder And Director Business DevelopmentMsg Lithoglas Ag Dec 2006 - Dec 2011Development and production of microstructured glass (MSG) as high-reliable passivation for semiconductors or as functional elements in optical devices and MEMS (www.lithoglas.com) -
Founder And CeoConsil Pte. Feb 2008 - Aug 2009Technology and Strategic Consultants for wafer-level-packaging and TSV with special focus on optical devices and MEMS.Based in Singapore we support business development, process integration and production ramp-up worldwide.
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Business Development AsiaFraunhofer Izm, Berlin Aug 2007 - Jul 2009Key Account for TSV R&D Projects in Asia
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Director TechnologySchott Advanced Packaging Singapore Ltd. Apr 2004 - Dec 2007Starting up production line for contract packaging service using Through-Silicon-Via Wafer-Level-Packages (TSV) for sensor applications esp. image sensor mobile phone.Fab Concept, Decision on equipment and material selectionTechnology Transfer, Process Fix and Ramp-UpCTO and Head of world-wide R&D team in Singapore, Berlin and JapanBusiness development and Key AccountsProcess Integration, R&D Strategic DevelopmentIP
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Project Manager Advanced PackagingSchott Electronic Packaging Gmbh Jan 2001 - Mar 2004Manager New BusinessDevelop of advanced packaging solutions on wafer-levelproject management, IP strategy, business development
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Public Relations ManagerResearch Center Rossendorf, Dresden Jan 1998 - Jan 2001Assistant to the Scientific Director; Internal and External Communication, Entrepreneurial Programms, Teacher and Undergraduate Programms, Private Public Partnerships, IP
Juergen Leib Skills
Juergen Leib Education Details
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Physics -
Physics
Frequently Asked Questions about Juergen Leib
What company does Juergen Leib work for?
Juergen Leib works for Fraunhofer Iisb
What is Juergen Leib's role at the current company?
Juergen Leib's current role is Group Manager at Fraunhofer IISB.
What is Juergen Leib's email address?
Juergen Leib's email address is juergen.leib@gmx.de
What schools did Juergen Leib attend?
Juergen Leib attended University Of Bayreuth, University Of New South Wales.
What skills is Juergen Leib known for?
Juergen Leib has skills like Semiconductors, R&d, Start Ups, Business Development, Product Development, Sensors, Project Management, Mems, Business Strategy, Entrepreneurship, Thin Films, Product Management.
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