Industrial Physicist and R&D LeaderAreas of expertise include:Technical Strategy, Plasma Processing/Treatment , Plasma Diagnostics, Research & Development, Physical Vapor Deposition, Adhesion Metrology, Process Scale-Up, Surface Modification, Experimental Design, Pilot Processes, Adhesion Technology, and Data Analysis Broad-based scientific thinker, able to make significant contributions in new areas. Analytical problem solver with proven ability to identify key challenges and define high-value paths forward. Excellent leadership and communication skills. Extensive experience with interdisciplinary teams and industrial-academic collaborations. Computer skills include programming in Visual Basic, Microsoft Word, Excel, and PowerPoint.I seek to apply my talents to have significant impact. Past examples include:٭ Design of linear organic vapor source for large-area deposition of organic materials (for organic light emitting diode displays), significantly improving coating uniformity (10 X improvement), robustness of operation, and reducing startup time (10 X improvement); developed vapor flow model and derived key design criterion for robust operation of this source; applied model to novel deposition concepts and filed invention disclosures.٭ Design and development of high-efficiency plasma source for polyester, polyolefin, and paper webs, boosting process speed by 5X over prior technology.٭ Doubling the throughput of an etch tool by identifying a process that dramatically reduced the process residue and increased the utilization of the tool.Specialties: Familiar with microfluidic (inkjet) devices, stroboscopic photography, sputter deposition, thermal vapor deposition, ionized physical vapor deposition, atomic layer deposition, plasma polymerization, plasma web treatment, plasma diagnostics, vacuum systems, cryogenic systems, low-temperature high-pressure cells, vibrational excitations in solids, compositional analysis by x-ray fluorescence, quartz crystal microbalance techniques, laser interferometric metrology techniques.