Installation Team Engineer at AMAT(2019/9~present) • Perform worldwide ATM/RP Epitaxy tool from Tier0 to Tier2. • Ramp up EPI tool for tsmc from N10 to N3. • RP/ATM EPI Standard tool installation • RP/ATM EPI Prime tool installation • Analyze, diagnose and troubleshoot equipment for EPI tool • Retrofit Centura ACP MF DB9 robot in ATM EPI prime at Global Wafer Taisil. • Responsible for EPI Mayan project at tsmc F18A. • Pyra tool installation. • Retrofit Produce GT MF Mag9 robot in Pyra at tsmc F18B. • AMAT global technical learning center EPI instructor.（as a iteammember support training center)FEOL Dry Etch Process Engineer at tsmc (2017/7~2019/8) • 10nm/7nm FEOL dry etching equipment(TEL Certas LEAGA/ AMT Producer GT)acceptance for tool release• Optimize production recipe for oxide remain defect, Improvement rate achieve to 45%• Tuning Monitor recipe link with production recipe for easy maintenance• Tuning 10nm/7nm production recipe for Productivity improvement• Responsible for one of 10nm layer and two of 7nm layers• Defined tool alarm re-etch SOP• Maintain SPCFEOL Dry Etch Equipment Engineer at tsmc(2016/8~2017/7)• Installed 10nm/7nm FEOL dry etching equipment, include TEL Vigus and TEL Certas LEAGA• Familiar with TEL Certas LEAGA equipment operation and intermediate in AMT Producer GT equipment operation