• Represent policyholders with first-party homeowners insurance claims.

• Investigated EEO complaints, interviewed witnesses, and drafted affidavits and final reports.

• Reviewed and classified client documents in preparation for asset transfer.

• Provided Intellectual Property litigation support, including performing research and drafting motions and responses.

• Drafted responses to Office Actions, opinion letters, and advisory letters to foreign affiliates.• Drafted and amended patent claims for new and pending patent applications.

• Researched a variety of legal subject matters.

• Primary responsibilities included ownership and development of etch metrology and process control strategies. Tool owner and process engineer for CD-SEM, film thickness, scatterometry, and profiler metrology equipment.• Responsible for capital planning, evaluation, selection, purchase, installation, and qualification of CD-SEM, scatterometry, and film thickness metrology equipment for 90 and 65-nm technology nodes.• Etch technology transfer leader for 65-nm flash technology node. Assignment entailed acting as the information liaison between research and manufacturing facilities and developing, characterizing, and preparing new processes for insertion into production.• Developed metrology and process control strategies for all etch manufacturing processes related to 130, 110, 90 and 65-nm flash technology nodes.• Active member of multiple cross-module steering teams for new technology insertion, capital equipment selection and capacity modeling, advanced process control development and implementation, and sort and line yield improvement.

• Completed one-year rotational engineering assignment, including individual sustaining and project engineer duties in the CMP, diffusion, implant, photolithography, and etch process modules.• Sustained the etch module in a continuous manufacturing environment. Assumed ownership of equipment and process issues that arose on shift, tracked and managed work in progress, monitored and sustained etch advanced process controllers, and leveraged rotational experience to solve inter-module manufacturing issues.• Etch technology transfer leader for 90-nm flash technology node. Assignment entailed acting as the information liaison between research and manufacturing facilities and developing, characterizing, and preparing new processes for insertion into production.• Performed tool startup on first dual damascene oxide etch chamber, including multi-layer process development and routine tool quality control implementation.• Contributed to the development of fab-wide copper protocol guidelines during the transition to copper as the back-end metal used in Flash devices.