Johan Jacobs Email & Phone Number

Veldhoven, The Netherlands

Part of our metrology tools business, I was a group manager and function owner for the mechatronic modules in our Yieldstar product line: wafer handling and wafer positioning. Goal is to increase throughput, increase availability, and lowering wafer defectivity.

Veldhoven, The Netherlands

Function owner of the NXE wafer stage module. Leading a team of professionals (architects and designers) for the development of the NXE:3600 wafer stage with focus on throughput improvements. My team developed methods to lower the added particles per wafer pass to reduce defects on wafer level. Furthermore, we increased the reliability of the wafer stage to support the overall scanner availability. We contributed in our factory for several cycle time improvements to support increased output.Next to my role as function owner for wafer stage, I was leading the competence engineers and architects for the development of our high-power electromagnetic actuators. These actuators drive our stage systems at high speed and high accuracy, mainly for wafer stage, reticle stage, and reticle masking for our DUV and EUV systems. Next to detailed design, I was involved in the industrialization of these actuators in our ASML Motion factory and at our supplier Tecnotion.

Hillsboro, Or, Usa

Leading the tech support team for EUV in the Hillsboro local office supporting Intel to introduce high volume manufacturing for the NXE:3400 systems. The team was responsible for all the hardware and software modules in the EUV scanner. Together with my team we introduced the lean way of working with focus on continuous improvement initiatives.

Hillsboro, Or, Usa

Expatriate: support for the EUV roadmap on the NXE lithography scanners. Main focus are the mechatronics modules that deal with positioning and handling of wafers and reticles.

Veldhoven, The Netherlands

Working as multi-disciplinary architect in a team to develop the wafer handling and wafer flow modules for the next-generation lithography tools; dry (XT), immersion (NXT), and EUV (NXE) lithography. Specialist for the development of wafer flow specifications to meet throughput requirements including the wafer load on the exposure stages and the high-level machine control. Defining the trade-off between throughput, overlay, and cost of goods aspects in the system. Functional owner of the interface towards developer/coater tracks (TEL, Japan and SCREEN, Japan) regarding wafer exchange (including mechanics, electronics, and software). Also worked closely with our supplier VDL development team.

Hillsboro, Or, United States Of America

Full year expatriate: Introduction of EUV lithography at Intel by supporting the first-generation EUV lithography tool (NXE:3100). Specialist for wafer handling, wafer flow, and wafer positioning. Helped in the areas of illumination, metrology, and defectivity.

Veldhoven, The Netherlands

Development of wafer flow specifications to meet throughput requirements of immersion lithography (NXT:1950) and EUV lithography (NXE:3100) tools. The specifications are based on simulation models describing the mechanics and software implementation.

Veldhoven, The Netherlands

Development of driver and calibration software for dose control of the first-generation immersion lithography tools and EUV lithography tools.

Development of simulation models to describe responses of (child) restraint systems during a car crash. Defined the coupling of mixed-integer optimization algorithms with the computational expensive simulation models.

Doctorate, Mechanical Engineering

Activities and Societies: Alumni Systems Engineering (ASE) Performance quantification and simulation optimization of manufacturing flow.

Msc, Mechanical Engineering

Activities and Societies: Simon Stevin, Wetenschapswinkels Quantifying operational time variability: the missing parameter for cycle time.

Atheneum