John Lan Email and Phone Number

Perform Electro-Mechanical packaging design/analysis of ground support STE for NASA space launch program.

• Development team ME lead design engineer on an airborne LRUs Pneumatic System Controller, integration with breed air valves for Embraer Legacy 500 business jet, Layout chassis, circuit card & wedge-lok mechanism, thermal management cooling fan and cable/harness, etc. Designed ambient functional and thermal vacuum testing tools/fixtures, rack mount ATE test setup and ground support equipment. Task went through production readiness. (product being certified)• Developed a hub gear box for a military unmanned ground vehicle propulsion subsystem (FCS-MULE). Conceptual layout and modeling/kinematic simulation of complex planet gearing drive mechanism (spline shaft, ring gear, bearing, rotary seal and wheel axle/brake disc, etc.). Performed system integration with hydraulic actuator and controller. Conducted first level structural analyses and designed torque test fixture for functional verification. Task went through test readiness.

• Development team ME on NASA Orion/CEV attitude control rocket motor in the area of Avionics module, such as controller, thermal battery, energy bank, STE rack & EM packaging and Taurus II mechanical ground support equipment. • Designed rocket engine propulsion system related components/subassemblies, such as: Isogrid nozzle extension, gimbal ring assy, thrust chamber and turbo pump assy.

• Performed the product design of the navigation inertia ref. instrument for the SBIRS program (i.e. electronics enclosure, CCA and interconnection, prototype tooling, and HRG Gyroscope).* Supported SBIRS payload ambient environmental test program in the design and documentation of special test equipment and tooling, (i.e. test rack, breakout box, interface test adapter and 3-D cable routing).

• Responsible for the product design of RF electronic telecom receiver and transmitter units for spacecraft. Tasks included: formulating the conceptual CAD layout, working on the cost & schedule issues, debugging of prototypes, tolerance study and generating drawings and PDM documents.• Designed the microelectronic packaging, multilayer PWB and interconnection, and verification of thermal/structural/vibration analysis. Designed fixtures for precision alignment on MMIC modules and ribbon chip/wire bonding.• Redesigned a chassis for a transmitter unit, which results in low cost, lightweight, hermetic sealed, miniature and high strength packaging.

• Responsible for the product design of RF electronic telecom receiver and transmitter units for spacecraft. Tasks included: formulating the conceptual CAD layout, working on the cost & schedule issues, debugging of prototypes, tolerance study and generating drawings and PDM documents.• Designed the microelectronic packaging, multilayer PWB and interconnection, and verification of thermal/structural/vibration analysis. Designed fixtures for precision alignment on MMIC modules and ribbon chip/wire bonding.• Contributed to the design standardization for the department and acted as a REA role to interface with EE, Manufacturing engineer, system engineer and program.

• Performed the product design and development of various optical lab instruments (i.e. DNA sequencer, spectrophotometer and micro-fluidics sample handling transporter) from conception to production. Designed optical bench, mirror mount, sample compartment interfacing, circuit card and PWB interconnection and opto-mechanical alignment fixture.• Designed following the guidelines of DFM/DFA, which resulted in 42% overall parts reduction and shortened development cycle time by half.

• Performed the product design of a micro-fluidic medication system in the aspect of miniature lead screw pumping mechanism and instrument packaging.• Conducted design and validation of prototype tools and established the product manufacturing processes and test procedures in compliance with FDA regulations.