John Mortensen

John Mortensen Email and Phone Number

Tustin, CA, US
John Mortensen's Location
Tustin, California, United States, United States
John Mortensen's Contact Details

John Mortensen work email

John Mortensen personal email

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About John Mortensen

RF design engineer with 35 years of experience in high speed analog and RF circuits. Work experience includes:Recent MSEE graduate in Communications and Signal Processing from Cal Poly Pomona (2018). PhD candidate at University of Colorado, Colorado Springs. Officially in the program (ABT).Recently worked on a S-band module for used in a phased array ground RADAR application.Completed an X-Band receiver design used in ground RADAR application.High frequency transceiver (1-30 MHz) for shortwave communication. Lead engineer on an 11-Bit Analog to Digital converter for airborne RADAR.RFIC design experience with set-top box receivers at 1-4 GHz using Si Bipolar, BiCMOS, SiGe processes.I have experience using PIC micro-controllers devices for digital interface and DSP functions. I've also have had experience with numerous computer tools such as Cadence, Mentor PADS, DipTrace, Microwave Office, Agilent ADS, TopSpice and other Spice products, Mathcad and Altium. I have a good working knowledge of Excel, MS Visual Basic, PIC micro Assembly and Basic. I also have used HFSS for EM simulations.Other Specialties: Experience with design tools, RF test equipment and troubleshooting skills. Organization.

John Mortensen's Current Company Details
Microwave Packaging Technologies

Microwave Packaging Technologies

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RF Engineer
Tustin, CA, US
John Mortensen Work Experience Details
  • Microwave Packaging Technologies
    Microwave Packaging Technologies
    Tustin, Ca, Us
  • Microwave Packaging Technologies
    Senior Design Engineer
    Microwave Packaging Technologies Sep 2019 - Aug 2020
    Mission Viejo, California, Us
    Designed Receiver module used in phased array RADAR- PCB design- Gain/Noise Figure analysis- Testing of receiver- Calibration for line array as part of beam formerSolved product obsolescence issue for an old ICBM power supply controller- Found die part replacements for new hybridized module
  • Bastion Technologies, Inc.
    Reliability Engineer
    Bastion Technologies, Inc. Sep 2018 - Sep 2019
    Houston, Texas, Us
    Provided reliability analysis for several Jet Propulsion Laboratory (JPL) programs- Mars 2020, Europa Clipper, MAIA and Grace-FO programs- Failure Report analysis- Single Event analysis (SEEA) for John’s Hopkins Applied Physics Lab Radio- SEEA analysis for Diode Box- Worst Case analysis for REASON VHF Transmit/Receive module- SEEA review analysis for JPL Drive Electronics Unit for Bi-Axial Gimbel Assembly robotics.- Interface Failure Modes, Effect and Criticality analysis (I/F FMECA) for Grace LNA and Antenna interface.
  • Microwave Packaging Technologies
    Senior Rf Design Engineer
    Microwave Packaging Technologies Feb 2014 - May 2018
    Design for X-Band x8 multiplier used on FMCW RADAR- PCB design- Gain/Noise figure analysis Design of receiver and exciter for a digital receiver system- Receiver board design- Transmitter board design- Gain/Noise Figure analysis- Frequency planningDesigned 100 MHz to 2.5 GHz LNA using pHEMPT transistors.- Design matching circuits- Built prototypes using 0201 sized parts- RF probing to acquire S-Parameter data for transistors and passives- RF probing for S-parameter dataDesign and built a four channel S-Band receiver- Built chassis and chose connectorized components for receiver- Tested FPGA based DSP algorithm for beam formingDesigned a gate lockout circuit for an HPA productDesigned Ka Band Transmit/Receive Module- Wrote specifications- Designed module in low profile LTCC package- Prepared library of ICs in bare die form for use in the module- Wrote program for PIC to control features in module (phase adj., attenuation, gate bias)- Gain/Noise/Distortion distribution worst case analysis- Voltage and current de-rating for stress- Worst case power dissipation- PC board width/length analysis to determine line impedanceDesigned Super-heterodyne Digital Receiver for RADAR- Translated RADAR specification for use in radio system- Ran Microwave Office simulations for cascade of radio- Developed spreadsheet for radio cascade and spur search- PC Board Layout- Designed PCB layouts for evaluation boards at both IF and RF- Designed PCB layout for main RF, Power and distribution and FPGA boards- Tested Individual Sections- ADC Evaluation- Timing skew problems solved with new layout- Integrated new firmware for FPGA
  • Wireless R&D
    Senior Design Engineer
    Wireless R&D Jan 2013 - Dec 2013
    Wireless R&D (2012-2013)- Designed Microwave Multiplexer- Wrote specifications for Picocell radio interface- Designed Filters/Diplexer for both WiFi band and Public Safety- Microwave Office and HFSS simulation tools used- Diptrace layout using surface mount devicesPC Board Layout for Triplexer- Used a lumped component design for low WiFi band (2.4 GHz)- Coupled Filter design for the higher bands (4.9 and 5.8 GHz)
  • Iviu Technologies
    Design Consultant
    Iviu Technologies Feb 2012 - Nov 2012
    Redesigned WiFi board to implement an Audio output, change digital interfaces to a PIC controller and implemented serial UART connection. Supported PIC programming. SPICE analysis completed for interface design. PC Board Layout to implement redesign and future test capabilities.Also designed Bluetooth module board for ID tag/indoor positioning.
  • Microwave Packaging Technologies
    Director Of Engineering
    Microwave Packaging Technologies Apr 2010 - Jun 2011
    Mission Viejo, California, Us
    Designed 100 MHz to 2.5 GHz LNA using pHempt transistors. Designed matching circuits and implemented using 0201 sized parts on in-house designed substrate. Also performed RF probing for S-parameter data to use in designs.Participated in design and tested high power microwave amplifier chain from 6 GHz to 18 GHz- Built prototypes using 0201 passives and customer supplied MMICs- Layout of 6 GHz to 18 GHz attenuators on aluminum nitride substrates
  • Torrey Pines Technologies
    Design Engineer Consultant
    Torrey Pines Technologies Mar 2007 - Apr 2009
    Encinitas, California, Us
    Designed a High Frequency transceiver for shortwave communication. Responsible for design, testing and troubleshooting and supervised PCB layout which utilized surface mount technology. Specifications guided by Mil-Std-188-141B. Board included PIC device, MMIC and other RF components. Also implemented AGC loop using PIC microcontroller.
  • Rtg
    Design Engineer Consultant
    Rtg May 2004 - Jun 2005
    Plano, Texas, Us
    Design transmit/receiver IC used for utility company data collection and billing. Design used Jazz SiGe process. IC layout using Cadence Design System.
  • Wirelesshome Inc.
    Senior Ic Design Engineer
    Wirelesshome Inc. Nov 2000 - Apr 2002
    Part of team that redesigned transmitter section of 3.5 GHz TX/RX IC.Design tasks included:- Lowering noise and raising compression levels in both IF AGC section (350 MHz) and RF output amplifier (3.5 GHz).- Design used MAXIM SiGe process.- Ran simulations of 6 GHz Transmitter/Receiver used in wireless internet access product.- Ran simulations to verify wafer probe testing. Design implemented in MAXIM SiGe process.
  • Tdk Semiconductor
    Senior Ic Design Engineer
    Tdk Semiconductor Nov 1996 - Nov 2000
    Project lead for a Direct Conversion Receiver for use in US satellite TV. Design tasks included 900 MHz to 2150 MHz AGC, Mixer, VCO and I/Q Phase Shifter. Design implemented in PHILLIPS BiCMOS process.Project lead for a Direct Conversion Receiver for use in satellite TV. Design included 900 MHz to 1450 MHz AGC, Mixer and VCO and I/Q Phase Shifter. Design implemented in SSI BiCMOS process.
  • Hughes Aircraft Company
    Staff Engineer
    Hughes Aircraft Company Mar 1986 - Nov 1996
    Philadelphia, Pennsylvania, Us
    Worked with team on a 600 MHz Down Converter Mixer bipolar IC for use on ICO satellite. The task included simulation, layout and routing of the IC. Design implemented in MAXIM BiCMOS process.Worked with team on a 500 MHz I/Q Detector/Mixer bipolar IC for use on AGRANI cellular telephone satellite. The task included simulation, layout and routing of the IC. Design implemented in MAXIM BiCMOS process.Designed a 10 MHz 14-Bit sub ranging Analog to Digital Converter used on several airborne RADARs. The task required a mixed signal design for the architecture of the converter, designing a timing scheme and writing design requirements for four IC's required to implement the hybrid. The task included design, simulation, layout and routing of the hybrid.Testing Hybrid Mircrocircuit devices using manual and auto tests.

John Mortensen Skills

Analog Rf Circuit Design Pcb Design Mixed Signal Ic Semiconductors Integrated Circuit Design Cadence Digital Signal Processors Electronics Simulations Radio Frequency Microwave Testing Integrated Circuits Analog Design Assembly Microsoft Office Autocad Electrical Engineering Microcontrollers Spice Lna

John Mortensen Education Details

  • California State Polytechnic University-Pomona
    California State Polytechnic University-Pomona
    Electrical And Electronics Engineering
  • California State Polytechnic University-Pomona
    California State Polytechnic University-Pomona
    Electrical Engineering - Communications And Signal Processing
  • Orange Coast College
    Orange Coast College
    General Studies
  • University Of Colorado Colorado Springs
    University Of Colorado Colorado Springs
    Electrical And Electronics Engineering

Frequently Asked Questions about John Mortensen

What company does John Mortensen work for?

John Mortensen works for Microwave Packaging Technologies

What is John Mortensen's role at the current company?

John Mortensen's current role is RF Engineer.

What is John Mortensen's email address?

John Mortensen's email address is jm****@****orp.com

What schools did John Mortensen attend?

John Mortensen attended California State Polytechnic University-Pomona, California State Polytechnic University-Pomona, Orange Coast College, University Of Colorado Colorado Springs.

What skills is John Mortensen known for?

John Mortensen has skills like Analog, Rf, Circuit Design, Pcb Design, Mixed Signal, Ic, Semiconductors, Integrated Circuit Design, Cadence, Digital Signal Processors, Electronics, Simulations.

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