John Schneider Email & Phone Number

Kaysville, UT, US

Kaysville, Utah, United States

• Managed all aspects of Intel’s supply chain quality management systems with responsibilities for automated tools and quality system documentation.
• Managed Intel’s automated materials quality certificate system, handling thousands of certificates per day and maintaining quality status on billions of dollars of inventory.
• Managed the supplier audit tool, supplier non-conforming materials tools, and 5 others used by the entire corporation.
• Led the global supply chain quality management systems working group, managing a 3-year roadmap for 8 applications used across 9 business groups and coordinating all supply chain quality documentation.
• Directed 4 Agile Product Teams’ quarterly plans, weekly backlog, and work priorities.
• Gathered and prioritized user requirements. Balanced trade-offs between features.

Hillsboro, Oregon

• Managed all aspects of the Fab Materials Organization’s quality management systems. Developed and sustained supplier quality tools and documentation. Ensured software development teams met tool requirements.
• Authored a supplier guide to using Intel’s materials quality certificate system, reducing the time to setup by new suppliers and providing hundreds of suppliers with quick access to common solutions.
• Project managed my organization’s transition to a new supplier quality issue tool, delivering to user requirements and on-schedule.
• Project managed the rapid development of a tool to synchronize material lot status between Intel and third-party warehouses, preventing the delivery of unusable materials to the factories.
• Provided first level support to 4 quality system tools, documenting common issue solutions into process documentation.
• Created, deployed, and maintained the internal quality audit schedule in my organization.

Hillsboro, Oregon

• Engaged with supplier engineers, managers, vice presidents, and CEOs to align with Intel quality expectations and quality management systems.
• Led the global supply chain quality auditors working group, creating best practices for audits, maintaining audit checklists and tools, and monitoring gap closure across Intel’s 9 supply chain organizations.
• Led the global supply chain statistics and process controls working group, establishing corporate indicators and improving the indicators by 85% over one year.
• Co-chaired 9 task forces for issues threatening to shut down fabs. Kept the material supply intact, identified root causes, and fixed the problems.
• Audited supplier business and quality systems at ~60 sites, reviewed supplier audit gap closure plans and tracked to satisfactory closure.
• Developed a supplier deep dive audit methodology to compliment the standard supplier audits. Increased the ability to detect supplier issues in areas of targeted risk.

Hillsboro, Oregon, United States

• Enhanced substrate data management systems and improved early detection processes through the effective deployment of automated tools.
• Defined, developed, and deployed automated tools for supplier quality monitoring and triggering. Eliminated 32 weekly man-hours to create and distribute multiple reports, changing focus from report generation to.
• Rearchitected Intel’s material parameter definitions, reducing sampling and reporting requirements and producing $35 million in savings over 3 years.
• Supported critical data analysis, problem solving, and engineering for ~5 supplier quality issues and ~20 continuous improvement projects.
• Core team member simultaneously on three change control boards managing supplier changes impacting Intel.

Hillsboro, Oregon, United States

• Developed methodologies, tools and systems for motherboard and wireless card contract manufacturing.
• Project managed deployment of a web-based supplier problem-solving tool, enabling secure collaboration with 3-6 suppliers. Presented the work at Intel’s Quality & Reliability Technical Symposium.
• Authored industry standard for resistance testing in connectors, simplifying the method and aligning multiple companies.
• Established a gage repeatability and reproducibility process with 3-6 contract manufacturers, improving customer line reject rates by >1,000 dpm.
• Created a tester control system to identify functional testers in need of maintenance, reducing the false failure rate by 10%.
• Led deployment to suppliers of a non-destructive motherboard stress test process and tool. Improved detectability by 3x over previous generation tool and process. Presented the work at an IEEE conference.

Hillsboro, Oregon, United States

• Developed methodologies for outsourced manufacturing quality as Intel transitioned between 3 supplier relationship models. Led problem-solving teams for the most complex issues in Intel’s motherboard business. Project.
• Conducted supplier selection audits at 10 sites to support acquisitions and increase global manufacturing capacity.
• Reduced customer-line fallout from 600 dpm to 18 dpm for a chipset attachment problem.
• Reduced manufacturer fallout from 3% to 0.2% for a socket attachment problem.
• Established methods to achieve equivalent quality from multiple outsourced manufacturers. Presented the work at Intel’s Quality and Reliability Conference.

Chandler, Arizona, United States

• Developed and stabilized chip attach processes and trained process engineers on new processes.
• Improved product yields to world-class levels >99.5% and reduced operational requirements to run the processes.
• Project managed installation and qualification of equipment for development and production lines.
• Conducted source inspection on production equipment to ensure fitness for function prior to delivery.
• Trained seed engineers from 3 sites on the new processes.
• Transferred the manufacturing-ready processes to 3 factories worldwide to enable product ramps.

Chandler, Arizona, United States

• Transferred a new wirebond process from development to production.
• Improved constraint capacity by 5%, eliminating major capital expenditures. Presented the work at the Intel Manufacturing for Excellence Conference.
• Characterized wirebonder pattern recognition systems to improve robustness to commodity supplier-to-supplier variation.
• Project managed the deployment of a wirebonder recipe automation tool which improved the programming time for new products by 800%.
• Project managed supplier improvements to improve consumable availability and reduce costs.

Greater Salt Lake City Area

Assessed the design issues of several law enforcement products. Developed and evaluated possible design variants that could perform the same function.

Woods Cross, Utah, United States

Supervised and instructed the pep band as an extra-curricular activities advisor.

Bountiful, Utah, United States

Painted interiors and exteriors. Stained and restored doors, cabinetry, and pianos. Customers included businesses, churches, and homes.

Bountiful, Utah, United States

• Supported production of telephone books and yearbooks.
• Line operator for book trimming, halftone scanning, and quality inspection.

Operations Research

Post-graduate studies in probability and statistics, stochastic models, deterministic modeling, and technology and strategic issues in.

Bachelor Of Science, Mechanical Engineering

Activities and Societies: Member of American Society of Mechanical Engineers. Capstone project for Ford Motor Co., Transmission and.