John P. Martinez Email & Phone Number

Chandler, Arizona, United States

Responsible for developing test methods for new SATCOM products and transferring them to production test.

Phoenix, Arizona, United States

Supervising production test team for test operations for a customer space project.Reporting yield result and defect paretos to customer engineering team.Coordinating work in progress coming into test from assembly.Managing twelve technicians and operators and managing shift schedules to provide 24 hr test coverage.Interview prospective employment candidates and making recommendations for prospective new hires.Coordinating the installation of production equipment and facilities for production and engineering test inside a new clean-room.Reporting status of all work to the internal management team.

Phoenix, Arizona, United States

Lead Engineering Technician working with production test team for a customer space project. Coordinating work in progress coming into test from assembly. Managing eight technicians and operators and managing shift schedules to provide test coverage to achieve weekly commitments. Interview prospective employment candidates and making recommendations for prospective new hires.Coordinating the installation of production equipment and facilities for production and engineering test inside a new clean-room. Working with test engineers in the engineering lab to provide potential customers needed data for DOE projects. Managing all test equipment in the engineering lab to make sure it is in calibration and good working order.Interface with manufacturing and sales representatives for purchase of RF components needed for general and specific test measurements.

Chandler, Az

I assemble and test multi-band GaAs and SiGe PA modules on laminate circuit boards. I tune modules for optimum output power, power added efficiency, gain, harmonics, and ACPR per customer specification. I perform RF Probing on laminate modules for impedance measurements of transmission lines. Reliability ruggedness testing at 50ohm and various VSWR settings, sweeping VCC or Input power at either closed or open loop power out. Ruggedness is performed at room temp and -30C cold temp. Assembly responsibilities are die attach, wire-bond, and placing SMT components size 0201 and 01005, placing PA modules on customer PCB's using SMT reflow system.

I assembled and tested PA and LNA modules supporting product engineering for GaAs MMIC group. Test for S-parameters, gain, Output Third Order Intercept, Dual band intermodulation, P1dB, Input and Output Return Loss, and Noise Figure measurements.I performed Load Pull testing to vary impedance for output power, gain, input return loss, and efficiency as a function of load impedance presented to the device under test. I designed and generated evaluation PCB's on AutoCAD including multilayer and dual band experimental boards. * Experienced with Die Bond, Wirebond, RF Probing, and SMT soldering.

I aligned and tested RF Microwave modules for military applications. I performed functionality testing at set temperatures. The data was analyzed to ensure module performed to specification.I applied conformal coating to finished PCB and hermetically sealed the module. I participated in Kaizen to improve process flow and rebuilt assembly areas to implement the plan. The process flow time was able to be improved by approximately thirty percent and reduce downtime between process.

I developed RF testing procedures on Wireless Amplifier Modules samples for signal integrity per customer specification for band-pass filters, power amplifiers, and low-noise amplifiers using SMA test fixtures or RF probing.I co-authored test procedures for High Volume Manufacturing Transmit and Receive measurements. The procedures are used on high-speed testers to set all parameters needed for all testing. I worked with test team to develop PC based automated testing to minimize bench testing and data collection for all wireless products. Production test times were reduced 40% to assist engineering to meet deadlines for data correlation.I forecast equipment needs for the upcoming fiscal year and submitted a budget for equipment purchases. I facilitated meetings with test equipment sales representatives to have demos of lab equipment and supplies.I purchased over 2 million dollars of test equipment to have a functional electrical lab. This resulted in receiving a 130 million dollar contract from a major customer for next generation wireless capabilities. I negotiated a calibration agreement with equipment manufacturer for all lab equipment and received a 10% discounted rate. Worked with Agilent service managers to reduce calibration turn around times 33% to minimize downtime. I maintained equipment calibration schedules and coordinated with engineering to have equipment to send out for calibration. I arranged for equipment manufacturer to send equipment on loan when needed.I mentored newly hired technicians, provided training on equipment measurements, electrical modules and measurement methods or techniques. Implemented laboratory safety rules and ensured all users were in compliance.

Chandler, Az

I supported microprocessor package platforms in the development and implementation stages of new microprocessor package technologies. I organized and lead project meetings. I established project milestones and timelines based on the package design and scope of work. I performed project management and reviewed project progress in management meetings.I provided lab support for electrical validation and metrology development activities for packaging integrity and power delivery aspects. Measurements performed were impedance, cross talk, resistance, capacitance, and S-parameter measurements of microprocessor packages as well as characterization of discrete components. I coordinated Measurement Capability Analysis for lab methodologies. Created test procedures for new methodologies introduced into the lab after ensuring that the equipment passed the Measurement Capability Analysis and Gage Repeatability and Reproducibility studies.

Berlin, Germany