Grant dowsing and sanity checking.

Employed a variety of electron beam and optical probing and imaging systems inconjunction with electrical bench test equipment or automated test equipment (ATE) tolocate faults in integrated circuits. Tools included: electron beam voltage prober,infrared emission microscopes, TIVA/OBIRCH (scanning laser probe microscope),scanning acoustic microscope, electron microscope. Maintained, repaired, andupgraded many of the systems described above, including customization of electricalpower and liquid nitrogen delivery systems.Discussed failure analysis methods with product engineers to help determine whichfailure analysis techniques would be suitable for their product, and the requirementsfor the test interface board in order to use those techniques. Worked with customboard manufacturers to ensure compatibility with our testers and with the device to betested. In some cases, designed and built test interface boards in-house tailored tocost or time constraints associated with a project.Performed competitive construction analysis of IC and MEMS products, includingchemical, laser, and mechanical decapsulation, cross sectioning, parallel polishing,high resolution microscope imaging, and EDS/EDAX elemental analysis.

Computer Instrumentation Design (AEP-264)Computational Engineering Physics (AEP-438)

Sponsored by the Princeton Plasma Physics Laboratory. Wrote a subroutine inFORTRAN/BASIS to solve the coupled Poisson and fluid equations for the motion ofelectrons and the electrostatic potential in a magnetically confined plasma.

Helped evaluate the use of multi-layer feed-forward neural networks for face-basedidentity verification. Participated in the creation of data sets. Trained and evaluatedneural networks with different training sets and layer configurations.