A principal-level contributor to the company’s Business Planning group, with primary focus on achieving the company’s main strategic objectives for designated key accounts. ● Worked extensively with in-house legal group to ensure that our contracts are favorable to the company, especially in regards to the company’s key strategic objectives. ● Coordinate with other functional teams (costing, pricing, manufacturing, sales, etc.) to ensure that Business Planning core objectives are front-and-center in all negotiations.

• Led an effort to stabilize, rebuild, and restaff the Business Development Group, the company's sales team. Team consisted of Key Account Mgrs, Channel Sales Mgrs, Regional Sales Mgrs, Service Partners Mgr, along with associated Project Engineers, Application Team Leads, and Specialists.• Also acted as primary account manager for two of the most strategically important accounts, to minimize risk in potential revenue drop from these high-value customers.

• Managed high-value enterprise server / semiconductor customers (company revenues from $15B-$74B), providing custom solutions and developing long-term relationships with key industry contacts. • Led internal team of 9 direct-reports and owned entire business process for each program, from concept and product design to engineering, quotation and cost-down negotiations, prototypes, qualification and QA, and through to mass production and delivery. Also leveraged indirect global engineering resources, as needed, in order to meet customer timelines for custom solutions.• Collaborated with customer procurement, product development, engineering, quality, supply chain, and ODMs/build partners in the design and production of hundreds of custom hardware products.Key Accomplishments:• For largest enterprise account, effectively displaced the previous suppliers by hitting 94% program closure rate, winning 17 of 18 major RFQs on customized NBOs, spanning 3 product generations. • Got us in the door with a leading semiconductor account my company had been pursuing for years and was awarded project to co-develop, build, and qualify a novel thermal solution that has the potential to disrupt the consumer microprocessor space. Led a multi-disciplined internal team (including VP Product Director, CTO, MFG management), and ran 3x/week status calls with a team of 15+ customer stakeholders from management, engineering, manufacturing, and procurement, across the US, Taiwan, China, and Malaysia. • Ran 7 large-volume, technically challenging projects for world leader in the exascale computing space, with a team of 20+ stakeholders. Pulled resources from across China, Mexico, Taiwan, India, and the US to make this happen.

• Grew global sales from an almost non-existent $500K to $18M for a major IT/computer company. • Managed all thermal sales activity in half of the US and all of Latin America.• Managed channel sales activity, leading a team of internal Sunon district sales managers and directing 10 manufacturing rep groups, while also working in tandem with our major distribution sales partners.

• Led program management activity for new custom thermal solutions, coordinating work between my Taiwan HQ R&D team and both internal & external development engineering groups.• Responsible for development and management of new high-value target key accounts, including Dell, Compaq (now HPE), Apple, and Cisco.

• Primary technical resource for Sunon’s US sales team, major customers, and manufacturing rep partners and distributors. • Worked with customer R&D to design and develop custom thermal products, provide technical information, and troubleshoot engineering issues.

• Led multi-disciplinary teams responsible for taking products such as connectors, fiber optic enclosures, and fiber-to-the-desktop interconnect systems from initial concept to a final market-ready product. • Awarded a US patent for a novel fiber optic installation/maintenance tool. • Presented a technical white paper at NFOEC (National Fiber Optic Engineers Conf).

• Designed, developed, and tested products for a unique modular and tool-less telecom wire terminating system. • Developed expertise in design of plastic-injection molded, metal-stamped parts, sheet metal forming, extrusion and die casting, and qualification to industry telecom specs.

• Completed 3 mechanical engineering Co-Op semesters on aerospace/defense projects, while completing my BSME studies.• Upon graduation, worked full-time as Mechanical Design Engineer, through Sept 1990.