As Principal Consultant in the Asset Transactions and Advisory Practice at Leidos Engineering (formerly SAIC and R.W. Beck) my role is to help lenders, project developers, EPCs, utilities, etc. manage risk associated with emerging PV technologies by providing due diligence, independent engineering, and related advisory services.

• Lead team of PhD engineers to develop high efficiency n-type solar cells via ion implantation, including bifacial n-type cells and interdigitated back contact (IBC) cells.• Together with commercial partners (Samsung, BOSCH) demonstrated world record efficiency large area homojunction solar cell (22.1% for 156mm cell)• Lead joint development programs with key commercial partners and research institutes• Principal Investigator and grant writer of $4.8M US Dept of Energy Sunshot Grant to support next generation ion implant tool

Varian Semiconductor was acquired by Applied Materials in 2011

• Technical lead (and 3rd employee) of MIT spin-out to commercialize Photonic Lattice LEDs for rear projection televisions (RPTVs).• Delivered multiple prototypes to customers on time and exceeding performance targets under very demanding consumers electronic timelines.• Directed and prioritized activity within the Device Engineering, Test Engineering, Reliability, and Packaging departments.• Managed rapidly evolving technology generations to meet customer needs and roadmap.• Performed extensive design verification for new products and platforms.• Lead three generations of products through qualification, eventually achieving >100khr MTTF and passing internal qualifications at multiple customer installations.• Extensive failure mode analysis experience including leading cross disciplinary teams in systematic problem solving efforts, rapid implementation of design, and process solutions.• As device engineer, lead engineer in the development of world’s highest brightness LEDs.• Developed unique LED fab process from “white-board” to production.• Developed advanced device structures enabling industry leading operational current density, power dissipation, and thermal resistance.• Instrumental in developing novel LED fabrication process including excimer laser processing, wafer bonding, thin film deposition, and high throughput nanolithography.• Generated process documentation including travelers, work instructions, and standard operating procedures.• Key team member in set-up of complete semiconductor fabrication facility including equipment identification, installation, and process qualification.